| No. |
Part Name |
Description |
Manufacturer |
| 181 |
MPX5500 |
MPX5500 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
Motorola |
| 182 |
MPX5700 |
MPX5700 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
Motorola |
| 183 |
MRFIC1817 |
1700-1900 MHz MMIC DCS1800/PCS1900 INTEGRATED POWER AMPLIFIER GaAs MONOLITHIC INTEGRATED CIRCUIT |
Motorola |
| 184 |
MRFIC1818 |
1700-1900 MHz MMIC DCS1800/PCS1900 INTEGRATED POWER AMPLIFIER GaAs MONOLITHIC INTEGRATED CIRCUIT |
Motorola |
| 185 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 186 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 187 |
MSM5105 |
MOBILE STATION MODEM, 3G CDMA Enabling Chipset (Pin compatible with the MSM3100 in a 208 FBGA package) |
QUALCOMM Incorporated |
| 188 |
MST4110C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY Bright Red |
Fairchild Semiconductor |
| 189 |
MST4140C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY |
Fairchild Semiconductor |
| 190 |
MST4410C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY |
Fairchild Semiconductor |
| 191 |
MST4440C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY |
Fairchild Semiconductor |
| 192 |
MST4910C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY |
Fairchild Semiconductor |
| 193 |
MST4940C |
10mm (0.400 inch) Three Digit NUMERIC STICK DISPLAY |
Fairchild Semiconductor |
| 194 |
MWS11-PH43-CS |
CDMA 2000 InGaP HBT Power Amplifier |
Microsemi |
| 195 |
N08E |
8 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 196 |
N14A |
14 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 197 |
N16A |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 198 |
N16E |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 199 |
N16G |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package, Thermally Enhanced |
National Semiconductor |
| 200 |
N18A |
18 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 201 |
N20A |
20 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 202 |
N20B |
20 Lead 0.300 Inch Wide Molded Dual-In-Line Package |
National Semiconductor |
| 203 |
N22A |
22 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 204 |
N22B |
22 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 205 |
N24A |
24 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 206 |
N24C |
24 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 207 |
N24D |
24 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 208 |
N24E |
24 Lead (0.400 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 209 |
N28B |
28 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 210 |
N40A |
40 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| | | |
