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Datasheets found :: 202
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No. Part Name Description Manufacturer
181 MS56A 56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
182 MSA20 20 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
183 MSA24 24 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
184 MSA28 28-Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
185 MTA20 20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I National Semiconductor
186 MTB24 24-Lead Molded Thin Shrink Small Outline Package National Semiconductor
187 MTC08 8-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
188 MTC14 14 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
189 MTC16 20-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
190 MTC20 20 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
191 MTC24 24 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
192 MTD48 48 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
193 MTD56 56 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
194 RMKM-S Small Outline Resistor Networks, Ultra Film, Thin Film Technology Vishay
195 SOGC 01,03,05 SCHEMATICS Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Vishay
196 SOGC, 45 AND 46 SCHEMATICS Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Vishay
197 SOMC Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Vishay
198 TCM850 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
199 TCM851 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
200 TCM852 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
201 TCM853 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
202 TSSO20 20-LEAD THIN SHRINK SMALL OUTLINE ST Microelectronics


Datasheets found :: 202
Page: | 3 | 4 | 5 | 6 | 7 |



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