| No. |
Part Name |
Description |
Manufacturer |
| 181 |
PACKAGING |
Packaging and Die Information |
Comlinear Corporation |
| 182 |
PACKAGING |
INFORMATIONS about IC packaging from XICOR DATABOOK 1985 |
Xicor |
| 183 |
PACKAGING |
INFORMATIONS about IC packaging from XICOR DATABOOK 1985 |
Xicor |
| 184 |
PC87309 |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 185 |
PC87309-IBW/VLJ |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 186 |
PC87309-IBW_EB |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 187 |
PC87309-ICK/VLJ |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 188 |
PC87309-ICK_EB |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 189 |
PC87309VLJ |
PC87309 SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 190 |
PCI2050 |
32-Bit, 33 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master, MicroStar Packaging |
Texas Instruments |
| 191 |
PCI2050GHK |
32-BIT, 33 MHZ PCI-TO-PCI BRIDGE, COMPACT PCI HOT-SWAP FRIENDLY, 9-MASTER, MICROSTAR PACKAGING |
Texas Instruments |
| 192 |
PCI2050PDV |
32-BIT, 33 MHZ PCI-TO-PCI BRIDGE, COMPACT PCI HOT-SWAP FRIENDLY, 9-MASTER, MICROSTAR PACKAGING |
Texas Instruments |
| 193 |
PO55-10LR-PC-Z |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 194 |
PO55-14LR-PC |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 195 |
PO55-14LR-PC-Z |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 196 |
PO55-14P-CH |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 197 |
PO55-14P-CH1 |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 198 |
PO55-2P-316(L) |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 199 |
PO55-P-316 |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 200 |
PO55-T-1 |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 201 |
PTFT |
Surface Mount Chip, Linear PTC Thermistors, Nickel Barrier, Tin/Lead Wraparound Terminations, Available in Tape and Reel Packaging |
Vishay |
| 202 |
REPORT |
Lead (Pb)-Free Packaging Strategy 2000-2003 |
Advanced Micro Devices |
| 203 |
RF TRANSISTOR DESIGN |
Chip fabrication, basic operation and main parameters, noise, parasitic elements, packaging |
SGS-ATES |
| 204 |
TC54 |
The TC54 Series are CMOS voltage detectors, suited especially for battery-powered applications because of their extremely low 1uA operating current and small surface-mount packaging. Each part is laser trimmed to the desired threshold volt |
Microchip |
| 205 |
TPS61253 |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging. 5V Output Voltage |
Texas Instruments |
| 206 |
TPS61253YFFR |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging. 5V Output Voltage 9-DSBGA -40 to 85 |
Texas Instruments |
| 207 |
TPS61253YFFT |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging. 5V Output Voltage 9-DSBGA -40 to 85 |
Texas Instruments |
| 208 |
TPS61256 |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging. 5V Output Voltage |
Texas Instruments |
| 209 |
TPS61256B |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging 9-DSBGA -40 to 85 |
Texas Instruments |
| 210 |
TPS61256BYFFR |
3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging 9-DSBGA -40 to 85 |
Texas Instruments |
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