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Datasheets for SMALL OUTL

Datasheets found :: 207
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No. Part Name Description Manufacturer
181 MPXV6115V High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package Freescale (Motorola)
182 MQA20 20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
183 MQA24 24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
184 MS40A 40 Lead Molded Shrink Small Outline Package, EIAJ, Type III National Semiconductor
185 MS48A 48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
186 MS56A 56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
187 MSA20 20 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
188 MSA24 24 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
189 MSA28 28-Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
190 MTA20 20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I National Semiconductor
191 MTB24 24-Lead Molded Thin Shrink Small Outline Package National Semiconductor
192 MTC08 8-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
193 MTC14 14 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
194 MTC16 20-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
195 MTC20 20 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
196 MTC24 24 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
197 MTD48 48 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
198 MTD56 56 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
199 RMKM-S Small Outline Resistor Networks, Ultra Film, Thin Film Technology Vishay
200 SOGC 01,03,05 SCHEMATICS Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Vishay
201 SOGC, 45 AND 46 SCHEMATICS Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Vishay
202 SOMC Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Vishay
203 TCM850 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
204 TCM851 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
205 TCM852 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
206 TCM853 The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range Microchip
207 TSSO20 20-LEAD THIN SHRINK SMALL OUTLINE ST Microelectronics


Datasheets found :: 207
Page: | 3 | 4 | 5 | 6 | 7 |



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