| No. |
Part Name |
Description |
Manufacturer |
| 1831 |
ISL5861_2IB |
210MHz; 3.6V; 12-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 1832 |
ISL5929_2IN |
210MHz; 3.6V; 24mA; dual 12-bit, +3.3V, 130/210+MSPS, commLink high speed D/A converter. For quadrature transmit with IF range 0-80MHz, medical/test instrumentation and equipment, wireless communication systems, BWA infrastructure |
Intersil |
| 1833 |
ISL5961_2IA |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 1834 |
ISL5961_2IA |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 1835 |
ISL5961_2IB |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 1836 |
ISL5961_2IB |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 1837 |
JTC83230-0011S |
Single-Chip CMOS LSI for Calculators with Printers (applicable printer heads: M-31 manufactured by EPSON) |
TOSHIBA |
| 1838 |
JTC83230-0017S |
Single-Chip CMOS LSI for Calculators with Printers (applicable printer heads: M31/M31A manufactured by EPSON) |
TOSHIBA |
| 1839 |
JTC83230-0021S |
Single-Chip CMOS LSI for Calculators with Printers (applicable printer heads: M-42V/42TV/41TAV/48T manufactured by EPSON) |
TOSHIBA |
| 1840 |
JTC83230-0025S |
Single-Chip CMOS LSI for Calculators with Printers (applicable printer heads: PTMFL 63 manufactured by ALPS) |
TOSHIBA |
| 1841 |
KSC1187 |
NPN (TV 1ST/2ND PICTURE IF AMPLIFIER) |
Samsung Electronic |
| 1842 |
KSC3125 |
NPN (TV FINAL PICTURE AMPLIFIER APPLICATION) |
Samsung Electronic |
| 1843 |
KSC388 |
NPN (TV FINAL PICTURE IF AMPLIFIER APPLICATIONS) |
Samsung Electronic |
| 1844 |
LA7670 |
PLL type video detector for the high picture & sound quality |
SANYO |
| 1845 |
LC1000B |
MATERIALS LETTING DRAINAGE STRUCTURE DETAIL |
etc |
| 1846 |
LC7441 |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1847 |
LC7441 |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1848 |
LC7441N |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1849 |
LC7441N |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1850 |
LC7441NE |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1851 |
LC7441NE |
Picture-in-picture Controller for TVs and VCRs |
SANYO |
| 1852 |
LC749402BG |
LCD Picture Quality Improvement IC |
ON Semiconductor |
| 1853 |
LFX1200B-03F900C |
The ispXPGA architecture |
Lattice Semiconductor |
| 1854 |
LFX1200B-03F900I |
The ispXPGA architecture |
Lattice Semiconductor |
| 1855 |
LFX1200B-04F900C |
The ispXPGA architecture |
Lattice Semiconductor |
| 1856 |
LFX1200B-3F900I |
The ispXPGA architecture |
Lattice Semiconductor |
| 1857 |
LFX1200B-4F900C |
The ispXPGA architecture |
Lattice Semiconductor |
| 1858 |
LFX1200B-4F900I |
The ispXPGA architecture |
Lattice Semiconductor |
| 1859 |
LFX1200C-03F900C |
The ispXPGA architecture |
Lattice Semiconductor |
| 1860 |
LFX1200C-03F900C |
The ispXPGA architecture |
Lattice Semiconductor |
| | | |
