| No. |
Part Name |
Description |
Manufacturer |
| 2011 |
IRF |
Epoxy Conformal Coated Inductor |
Vishay |
| 2012 |
IRF-24 |
Epoxy Conformal Coated Inductor |
Vishay |
| 2013 |
IRF-36 |
Epoxy Conformal Coated Inductor |
Vishay |
| 2014 |
IRF-46 |
Epoxy Conformal Coated Inductor |
Vishay |
| 2015 |
IRFK2K150 |
ISOLATED BASE POWER HEX PAK ASSEMBLY HALF BRIDGE CONFIGURATION |
International Rectifier |
| 2016 |
IRFK3D054 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2017 |
IRFK3D150 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2018 |
IRFK3D350 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2019 |
IRFK3D450 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2020 |
IRFK3DC50 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2021 |
IRFK3F054 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2022 |
IRFK3F150 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2023 |
IRFK3F250 |
lsolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2024 |
IRFK3F250 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2025 |
IRFK3F350 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2026 |
IRFK3F450 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2027 |
IRFK3FC50 |
Isolated Base Power HEX-pak Assembly - Half Bridge Configuration |
International Rectifier |
| 2028 |
IRFK4J054 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION |
International Rectifier |
| 2029 |
IRFK4J150 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION |
International Rectifier |
| 2030 |
IRFK4J350 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION |
International Rectifier |
| 2031 |
IRFK4J450 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION |
International Rectifier |
| 2032 |
IRFK4JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION |
International Rectifier |
| 2033 |
IRMCS201 |
Pre-configured Hardware Evaluation Platform with ServoDesigner tool |
International Rectifier |
| 2034 |
IXGN50N60BD2 |
IGBT Modules: Boost Configurated IGBT Modules |
IXYS |
| 2035 |
KS0070BM |
16com/80seg driver & controller for dot matrix LCD, mirror type pad configuration |
Samsung Electronic |
| 2036 |
L2791 |
Small emission spot LED using current confined chip |
Hamamatsu Corporation |
| 2037 |
L2791-02 |
Small emission spot LED using current confined chip |
Hamamatsu Corporation |
| 2038 |
L2791-03 |
Small emission spot LED using current confined chip |
Hamamatsu Corporation |
| 2039 |
L6460 |
SPI configurable stepper and DC multi motor driver |
ST Microelectronics |
| 2040 |
L6460TR |
SPI configurable stepper and DC multi motor driver |
ST Microelectronics |
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