| No. |
Part Name |
Description |
Manufacturer |
| 2041 |
614-99-952-31-012 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail |
Precid-Dip Durtal |
| 2042 |
614-99-952-41-001 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail |
Precid-Dip Durtal |
| 2043 |
614-99-964-31-012 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail |
Precid-Dip Durtal |
| 2044 |
614-99-964-41-001 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail |
Precid-Dip Durtal |
| 2045 |
6MBI10GS-060 |
IGBT MODULE ( Single-in-Line ) |
Fuji Electric |
| 2046 |
CA307E |
Operational Amplifier for Military, Industrial, and Commercial Applications, 8-lead dual IN-LINE plastic (MINI-DIP) |
RCA Solid State |
| 2047 |
CASE 620-08 |
16-Pin Ceramic Dual In-Line package |
Motorola |
| 2048 |
CASE 623-05 |
24-Pin Ceramic Dual In-Line package |
Motorola |
| 2049 |
CASE 632-07 |
14-Pin Ceramic Dual In-Line package |
Motorola |
| 2050 |
CASE 732-03 |
20-Pin Ceramic Dual In-Line package |
Motorola |
| 2051 |
CASE 733-02 |
28-Pin Ceramic Dual In-Line package |
Motorola |
| 2052 |
CASE 758-01 |
24-Pin Ceramic Dual In-Line package |
Motorola |
| 2053 |
CNS (CUSTOM) |
Single-In-Line Conformal Custom |
Vishay |
| 2054 |
CNS 471 (STANDARD) THIN FILM |
Single In-Line Six Decade Divider |
Vishay |
| 2055 |
CS201 |
Capacitor Networks, Single-In-Line, Coated SIP, ""D"" Profile, X7R and COG capacitors available, Multiple isolated capacitors, Multiple capacitors, common ground, Custom design capability |
Vishay |
| 2056 |
CSD |
Dual-In-Line, Ceramic Sandwich Custom |
Vishay |
| 2057 |
CTSP |
Single-In-Line Molded 6-10 Pin Custom |
Vishay |
| 2058 |
D08C |
8 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2059 |
D145 |
Single In-Line Conformal Coated Diode Network |
BI Technologies |
| 2060 |
D14D |
14 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2061 |
D14E |
14-Lead Hermetic Dual-In-Line Package |
National Semiconductor |
| 2062 |
D16C |
16 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2063 |
D16D |
16-Lead Hybrid Metal Can Dual-In-Line Package |
National Semiconductor |
| 2064 |
D18A |
18 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2065 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2066 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
| 2067 |
D24C |
24 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2068 |
D24H |
24 Lead (0.300 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2069 |
D24K |
24 Lead (0.400 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2070 |
D28D |
28 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
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