| No. |
Part Name |
Description |
Manufacturer |
| 211 |
HDSP-0882-FF100 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 212 |
HDSP-0882-FF200 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 213 |
HDSP-0882-FF300 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 214 |
K7I323682M K7I321882M K7I320882M |
1Mx36 & 2Mx18 & 4Mx8 DDRII CIO b2 SRAM Data Sheet |
Samsung Electronic |
| 215 |
K7I323682M K7I321882M K7I320882M |
1Mx36 & 2Mx18 & 4Mx8 DDRII CIO b2 SRAM Data Sheet |
Samsung Electronic |
| 216 |
K7R323682M, K7R321882M, K7R320882M |
1Mx36-bit, 2Mx18-bit, 4Mx8-bit QDR� II b2 SRAM Data Sheet |
Samsung Electronic |
| 217 |
MT90882 |
TDM to Packet Processors |
Zarlink Semiconductor |
| 218 |
MT90882B |
TDM to Packet Processors |
Zarlink Semiconductor |
| 219 |
MT90882BP1N |
TDM to Packet Processors |
Zarlink Semiconductor |
| 220 |
MT90882B_IG_BP1N |
TDM to packet processor. |
Zarlink Semiconductor |
| 221 |
MT90882IG |
TDM to Packet Processors |
Zarlink Semiconductor |
| 222 |
TR0808820Y |
Common Mode Toroidal Coils |
etc |
| | | |
