| No. |
Part Name |
Description |
Manufacturer |
| 211 |
HPR122 |
MINIATURE SIP, DIP AND SMD PACKAGES |
C&D Technologies |
| 212 |
HPR123 |
MINIATURE SIP, DIP AND SMD PACKAGES |
C&D Technologies |
| 213 |
HPR1XX |
MINIATURE SIP, DIP AND SMD PACKAGES |
C&D Technologies |
| 214 |
HYB25L128160AC |
128-MBIT SYNCHRONOUS LOW-POWER DRAM IN CHIPSIZE PACKAGES |
Infineon |
| 215 |
HYB25L128160AC-75 |
128-MBIT SYNCHRONOUS LOW-POWER DRAM IN CHIPSIZE PACKAGES |
Infineon |
| 216 |
HYB25L128160AC-8 |
128-MBIT SYNCHRONOUS LOW-POWER DRAM IN CHIPSIZE PACKAGES |
Infineon |
| 217 |
HYE25L128160AC-75 |
128-MBIT SYNCHRONOUS LOW-POWER DRAM IN CHIPSIZE PACKAGES |
Infineon |
| 218 |
HYE25L128160AC-8 |
128-MBIT SYNCHRONOUS LOW-POWER DRAM IN CHIPSIZE PACKAGES |
Infineon |
| 219 |
IC PACKAGES |
Plastic power package, similar to TO-220 (with cooling strip and 5 pins), Transparent plastic miniature package 6 pins |
Siemens |
| 220 |
IC PACKAGES |
Ceramic package 68 pins, C-CC, 88 pins, PGA |
Siemens |
| 221 |
IC PACKAGES |
Plastic package 44 pins, PLCC, 68 pins, PLCC |
Siemens |
| 222 |
IC PACKAGES |
Piggyback, special package |
Siemens |
| 223 |
IC PACKAGES |
Plastic power packages with cooling fin and 9 pins, SIP, Metal package 5 J 10 DIN 41873 (similar to TO100) |
Siemens |
| 224 |
IC PACKAGES |
Plastic power packages with cooling fin and 9 pins, SIP, Metal package 5 J 10 DIN 41873 (similar to TO100) |
Siemens |
| 225 |
IC PACKAGES |
Plastic plug-in Package 20 B 40 DIN 41866 40 pins, DIP, Miniature plastic package (G) 20 pins (SO20L) |
Siemens |
| 226 |
IC PACKAGES |
Plastic plug-in Package 20 B 24 DIN 41866 24 pins, DIP, 20 B 28 pins |
Siemens |
| 227 |
IC PACKAGES |
Plastic plug-in Package 20 A 20 DIN 41866 20 pins, DIP, 20 D 22 pins |
Siemens |
| 228 |
IC PACKAGES |
MICROPACK (SMD) for TCA205K, TLE4901K, TCA955K |
Siemens |
| 229 |
IC PACKAGES |
Miniature plastic package (SMD) 14 pins (SO14), 20 pins (SO20L) |
Siemens |
| 230 |
IC PACKAGES |
Miniature plastic package 6 pins, 8 pins, SMD 6 pins (similar to SO6), 8 pins (similar to SO8) |
Siemens |
| 231 |
IC PACKAGES |
Ceramic packages C-DIP, 40 pins, plastic flatpack 4 pins, 3 pins |
Siemens |
| 232 |
IC PACKAGES |
Ceramic packages C-DIP, 40 pins, plastic flatpack 4 pins, 3 pins |
Siemens |
| 233 |
IC PACKAGES |
Ceramic packages C-DIP, 16 pins, 24 pins |
Siemens |
| 234 |
IC PACKAGES |
Ceramic packages C-DIP, 16 pins, 24 pins |
Siemens |
| 235 |
IC PACKAGES |
Plastic Package Outlines, P-DIP, 4, 6 8, 14 pins, 20A DIN 41866 |
Siemens |
| 236 |
IC-PACKAGES |
FERRANTI IC packages, sharpe and dimensions |
FERRANTI |
| 237 |
IC-PACKAGES |
FERRANTI IC packages, sharpe and dimensions |
FERRANTI |
| 238 |
IDT71256SA15PE |
CMOS static RAM 256K (32K x 8-bit) in PE packages |
IDT |
| 239 |
IDT71256SA20PE |
CMOS static RAM 256K (32K x 8-bit) in PE packages |
IDT |
| 240 |
IDT71256SA25PE |
CMOS static RAM 256K (32K x 8-bit) in PE packages |
IDT |
| | | |
