No. |
Part Name |
Description |
Manufacturer |
211 |
335824B00034 |
TAPE Attachment Method |
etc |
212 |
380SOE |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
213 |
380SOE-F |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
214 |
3PM CASE |
CASE SHAPE AND DIMENSIONS |
IPRS Baneasa |
215 |
40PT2 CASE |
CASE SHAPE AND DIMENSIONS |
IPRS Baneasa |
216 |
45PT2 CASE |
CASE SHAPE AND DIMENSIONS |
IPRS Baneasa |
217 |
4PT2 CASE |
CASE SHAPE AND DIMENSIONS |
IPRS Baneasa |
218 |
500SOE |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
219 |
500SOE-F |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
220 |
500SOE-STUD |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
221 |
60PT2 CASE |
CASE SHAPE AND DIMENSIONS |
IPRS Baneasa |
222 |
8 LEAD CERAMIC (DA) |
Package Shape and dimensions |
Intersil |
223 |
84068 |
Tape and Reel Standards |
Vishay |
224 |
A-151B |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
225 |
A-151c |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
226 |
A-151d |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
227 |
A-153g |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
228 |
A-153h |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
229 |
A-1A |
Shape and dimensions CEI package |
SESCOSEM |
230 |
A-24 |
Shape and dimensions CEI package |
SESCOSEM |
231 |
A-3M |
Shape and dimensions CEI package |
SESCOSEM |
232 |
A-4M |
Shape and dimensions CEI package |
SESCOSEM |
233 |
A1 PACKAGE |
68 Contact Hermetic Ceramic Chip Carrier JEDEC Type A |
TRW |
234 |
A370 |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
235 |
A370-10A |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
236 |
A370-10B |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
237 |
A370-10F |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
238 |
A370-10G |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
239 |
A370-10N |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
240 |
A370-11A |
A370-Type Analog Uncooled Laser Module |
Agere Systems |
| | | |