| No. |
Part Name |
Description |
Manufacturer |
| 2341 |
ORDERING |
Ordering information - Plessey Semiconductors |
PLESSEY Semiconductors |
| 2342 |
ORDERING |
Customer ordering information |
Signetics |
| 2343 |
ORDERING |
Silicon Systems Ordering Information |
Silicon Systems |
| 2344 |
ORDERING PART NAME |
Device Ordering Information |
Siliconix |
| 2345 |
P1001A |
THSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC |
TOSHIBA |
| 2346 |
P100A |
THSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC |
TOSHIBA |
| 2347 |
P1014 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC |
TOSHIBA |
| 2348 |
P1015 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC |
TOSHIBA |
| 2349 |
P7152-10 |
Active area: 1x1mm; external input voltage:+-18V; infrared detector module with preamplifier: high sensitivity module of easy-to-use. For infrared detection |
Hamamatsu Corporation |
| 2350 |
P7152-10 |
Active area: 1x1mm; external input voltage:+-18V; infrared detector module with preamplifier: high sensitivity module of easy-to-use. For infrared detection |
Hamamatsu Corporation |
| 2351 |
P7752-10 |
Active area: 1x1mm; external input voltage:+-18V; infrared detector module with preamplifier: high sensitivity module of easy-to-use. For infrared detection |
Hamamatsu Corporation |
| 2352 |
P7752-10 |
Active area: 1x1mm; external input voltage:+-18V; infrared detector module with preamplifier: high sensitivity module of easy-to-use. For infrared detection |
Hamamatsu Corporation |
| 2353 |
PA2423 |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 2354 |
PA2423G |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 2355 |
PA2423G-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 2356 |
PA2423L |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 2357 |
PA2423L-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 2358 |
PA2423MB |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information |
SiGe Semiconductor |
| 2359 |
PA2423MB-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information |
SiGe Semiconductor |
| 2360 |
PACKAGE |
Package Information |
Precision Monolithics |
| 2361 |
PACKAGES |
A Complete presentation of CML's Package Styles (plus Despatch Packaging) in One PDF File Tape and Reel info updated |
CONSUMER MICROCIRCUITS LIMITED |
| 2362 |
PACKAGING |
Packaging and Die Information |
Comlinear Corporation |
| 2363 |
PART NUMBERING SYSTEM |
Ordering Information - Packaged Products Part Numbering System |
Precision Monolithics |
| 2364 |
PC-16T1 |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting) |
Kodenshi Corp |
| 2365 |
PC-16T1 |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting) |
Kondenshi Corp |
| 2366 |
PC-17K1 |
Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) |
Kondenshi Corp |
| 2367 |
PC-17K1C |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting) |
Kodenshi Corp |
| 2368 |
PC-17K1C |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting) |
Kondenshi Corp |
| 2369 |
PC-17K2 |
Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) |
Kodenshi Corp |
| 2370 |
PC-17K2 |
Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) |
Kondenshi Corp |
| | | |
