No. |
Part Name |
Description |
Manufacturer |
241 |
AUIRFN8401TR |
40V Single N-Channel HEXFET Power MOSFET in a PQFN 5 x 6 B/E package |
International Rectifier |
242 |
AUIRFN8403 |
Automotive Q101 40V Single N-Channel HEXFET Power MOSFET in a PQFN 5 x 6 E package |
International Rectifier |
243 |
AUIRFN8403TR |
Automotive Q101 40V Single N-Channel HEXFET Power MOSFET in a PQFN 5 x 6 E package |
International Rectifier |
244 |
AUIRFN8405 |
40V Single N-Channel HEXFET Power MOSFET in a PQFN 5 x 6 B/E package |
International Rectifier |
245 |
AUIRFN8405TR |
40V Single N-Channel HEXFET Power MOSFET in a PQFN 5 x 6 B/E package |
International Rectifier |
246 |
B1053 |
β1053 attenuator contain in one package three silicon diodes connected in order to form a PI network |
IPRS Baneasa |
247 |
BAS16S |
Silicon Switching Diode Array (For high-speed switching applications Internal (galvanic) isolated Diodes in one package) |
Siemens |
248 |
BAV99S |
Silicon Switching Diode Array (For high-speed switching applications Connected in series Internal galvanic isolated Diodes in one package) |
Siemens |
249 |
BC-148 |
148-Lead Chip Scale Package Ball Grid Array |
Analog Devices |
250 |
BG 3230 |
Two n-Channnel Automatic Gain Controlled RF-MOSFET in one Package |
Infineon |
251 |
BG 3230R |
Two n-Channnel Automatic Gain Controlled RF-MOSFET in one Package |
Infineon |
252 |
BH76706GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
253 |
BH76706GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
254 |
BH76906GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
255 |
BH76906GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
256 |
BH76909GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
257 |
BH76909GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
258 |
BH76912GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
259 |
BH76912GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
260 |
BH76916GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
261 |
BH76916GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
262 |
BSM200GAL120DN2 |
IGBT Power Module (Single switch with chopper diode Package with insulated metal base plate) |
Siemens |
263 |
BU10JA2MNVX-C |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
264 |
BU10JA2MNVX-CTL |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
265 |
BU10UA3WNVX |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
266 |
BU10UA3WNVX-TL |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
267 |
BU10UC3WG |
Versatile PackageFULL CMOS LDO Regulator |
ROHM |
268 |
BU10UC3WG-TR |
Versatile PackageFULL CMOS LDO Regulator |
ROHM |
269 |
BU11UA3WNVX |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
270 |
BU11UA3WNVX-TL |
Versatile Package FULL CMOS LDO Regulator |
ROHM |
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