| No. |
Part Name |
Description |
Manufacturer |
| 241 |
PE8003 |
Low power tramsimpedance amplifier |
Peregrine Semiconductor |
| 242 |
PE9301-00 |
3.5 GHz low power CMOS divide-by-2 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 243 |
PE9301-01 |
3.5 GHz low power CMOS divide-by-2 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 244 |
PE9301-11 |
3.5 GHz low power CMOS divide-by-2 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 245 |
PE9302-00 |
3.5 GHz low power CMOS divide-by-4 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 246 |
PE9302-01 |
3.5 GHz low power CMOS divide-by-4 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 247 |
PE9302-11 |
3.5 GHz low power CMOS divide-by-4 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 248 |
PE9303-00 |
3.5 GHz low power CMOS divide-by-8 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 249 |
PE9303-01 |
3.5 GHz low power CMOS divide-by-8 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 250 |
PE9303-11 |
3.5 GHz low power CMOS divide-by-8 prescaler for RAD-hard applications |
Peregrine Semiconductor |
| 251 |
PE9601-00 |
2.2 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 252 |
PE9601-11 |
2.2 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 253 |
PE9702-00 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 254 |
PE9702-01 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 255 |
PE9702-11 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 256 |
PE9704-00 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 257 |
PE9704-01 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 258 |
PE9704-11 |
3.0 GHz integer-N PLL for RAD-hard applications |
Peregrine Semiconductor |
| 259 |
RF-HDT-AJLC |
Tag-it HF-I Plus Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 260 |
RF-HDT-AJLC-G0 |
Tag-it HF-I Plus Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 261 |
RF-HDT-AJLE |
Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 262 |
RF-HDT-AJLE-G1 |
Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 263 |
RF-HDT-AJLS |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 264 |
RF-HDT-AJLS-G1 |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 265 |
RF-HDT-SJLS |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 266 |
RF-HDT-SJLS-G1 |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 267 |
SHEAR PATTERNS - DUAL GRID |
Transducer-Class® Strain Gages |
Vishay |
| 268 |
SHEAR PATTERNS - SINGLE GRID |
Transducer-Class® Strain Gages |
Vishay |
| 269 |
SIEMENS-IC-SYMBOLS |
Alphabetical compilation of the symbols used in Integrierte-Halbeiterschaultungen-1970 Databook |
Siemens |
| 270 |
SYMBOLS |
Symbols used in the Integrierte-Schaltungen-DTL-serie-MIC930-datenbuch 1970-71 |
ITT Industries |
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