No. |
Part Name |
Description |
Manufacturer |
2611 |
SM6155P |
Successive-approximation 8-bit A/D Converter |
Nippon Precision Circuits Inc |
2612 |
SM6155S |
Successive-approximation 8-bit A/D Converter |
Nippon Precision Circuits Inc |
2613 |
SMARTCARD |
Ordering Information For Package And Delivery |
ST Microelectronics |
2614 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
2615 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
2616 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
2617 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
2618 |
SOLDERING |
Soldering information - maximul conditions, flow soldering method |
PLESSEY Semiconductors |
2619 |
SOLDERING |
Soldering informations |
Siemens |
2620 |
SOLDERING |
Information from TUNGSRAM Handbuch der Transistoren 1971, about handling transistors, heat sensitivity, soldering |
TUNGSRAM |
2621 |
SOMC |
Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, |
Vishay |
2622 |
SP8602ACM |
ADVANCE INFORMATION |
Zarlink Semiconductor |
2623 |
SP8602BCM |
ADVANCE INFORMATION |
Zarlink Semiconductor |
2624 |
SP8604 |
ADVANCE INFORMATION |
Zarlink Semiconductor |
2625 |
SP8604ACM |
ADVANCE INFORMATION |
Zarlink Semiconductor |
2626 |
SP8604BCM |
ADVANCE INFORMATION |
Zarlink Semiconductor |
2627 |
SPEAr310 |
Embedded MPU optimized for automation and consumer applications |
ST Microelectronics |
2628 |
SPEAR310-2 |
Embedded MPU optimized for automation and consumer applications |
ST Microelectronics |
2629 |
SPEAr320 |
Embedded MPU optimized for factory automation and consumer applications |
ST Microelectronics |
2630 |
SPEAR320-2 |
Embedded MPU optimized for factory automation and consumer applications |
ST Microelectronics |
2631 |
SPT01-335DEE |
Automation sensor transient and overvoltage protection |
ST Microelectronics |
2632 |
SPT02-236DDB |
Automation sensor transient and overvoltage protection |
ST Microelectronics |
2633 |
SSI78Q8373 |
3V/5V PCMCIA Ethernet Combo - Advance Information |
Silicon Systems |
2634 |
ST7537 |
HOME AUTOMATION MODEM |
ST Microelectronics |
2635 |
ST7537HS1 |
HOME AUTOMATION MODEM |
SGS Thomson Microelectronics |
2636 |
ST7537HS1 |
HOME AUTOMATION MODEM |
ST Microelectronics |
2637 |
STA2051 |
32-BIT SINGLE CHIP BASEBAND CONTROLLER FOR GPS AND TELEMATIC APPLICATIONS |
ST Microelectronics |
2638 |
STA2051E |
32-BIT SINGLE CHIP BASEBAND CONTROLLER FOR GPS AND TELEMATIC APPLICATIONS |
ST Microelectronics |
2639 |
STA2051ETR |
32-BIT SINGLE CHIP BASEBAND CONTROLLER FOR GPS AND TELEMATIC APPLICATIONS |
ST Microelectronics |
2640 |
STA2051TR |
32-BIT SINGLE CHIP BASEBAND CONTROLLER FOR GPS AND TELEMATIC APPLICATIONS |
ST Microelectronics |
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