| No. |
Part Name |
Description |
Manufacturer |
| 2671 |
P03H |
3 Lead Molded TO-202 |
National Semiconductor |
| 2672 |
P03J |
3 Lead Molded TO-202 |
National Semiconductor |
| 2673 |
P04A |
4 Lead Molded TO-202 |
National Semiconductor |
| 2674 |
P11A |
11 Lead Molded TO-202 |
National Semiconductor |
| 2675 |
PA-SSD3SM18-08 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2676 |
PA-SSD3SM18-14 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2677 |
PA-SSD3SM18-16 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2678 |
PA-SSD3SM18-18 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2679 |
PA-SSD3SM18-20 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2680 |
PA-SSD3SM18-24 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2681 |
PA-SSD3SM18-28 |
PLUG PINS ARE SURFACE MOUNT SOLDERED TO THE CIRCUIT BOARD |
etc |
| 2682 |
PB-IRF1405ZL-7P |
Leaded 55V Single N-Channel HEXFET Power MOSFET in a 7-Lead TO-262 package |
International Rectifier |
| 2683 |
PBF-1201 |
Equipment Designed to Conform EMI Regulations Such As VCCI/CISPR/FCC/VDE/etc |
DENSEI-LAMBDA |
| 2684 |
PBF-1201-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2685 |
PBF-1202-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2686 |
PBF-1203-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2687 |
PBF-1206-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2688 |
PBP-3201 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2689 |
PBP-3201-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2690 |
PBP-3202-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2691 |
PBP-3203-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2692 |
PBP-3204-22 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2693 |
PBW-1201 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2694 |
PBW-1201-33 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2695 |
PBW-1202-33 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2696 |
PBW-1203-33 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2697 |
PBW-1206-33 |
Equipment Designed to Conform EMI Regulations Such As VCCI,CISPR,FCC,VDE,etc |
DENSEI-LAMBDA |
| 2698 |
PG-FPL2 |
Simple flash memory programmer dedicated to low pin count microcontroller |
NEC |
| 2699 |
PG-FPL2-X |
Simple flash memory programmer dedicated to low pin count microcontroller |
NEC |
| 2700 |
R03A |
3 Lead Molded TO-237 |
National Semiconductor |
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