No. |
Part Name |
Description |
Manufacturer |
31 |
AN-6096 |
Solid-State Approaches to Cooking-Range Control |
RCA Solid State |
32 |
AN1353 |
ST6200C SOFTWARE DESCRIPTION FOR COOLING THERMOSTAT APPLICATION |
SGS Thomson Microelectronics |
33 |
BAB-30 |
Water Cooling Assembly |
IPRS Baneasa |
34 |
BAB-50 |
Water Cooling Assembly |
IPRS Baneasa |
35 |
C30619E-DTC |
Large-area InGaAs photodiode. TE-cooler option, 2-stage TE cooler. |
PerkinElmer Optoelectronics |
36 |
C30619E-TC |
Large-area InGaAs photodiode. TE-cooler option, 1-stage TE cooler. |
PerkinElmer Optoelectronics |
37 |
C30619G-DTC |
Large-area InGaAs photodiode. TE-cooler option, 2-stage TE cooler. |
PerkinElmer Optoelectronics |
38 |
C30619G-TC |
Large-area InGaAs photodiode. TE-cooler option, 1-stage TE cooler. |
PerkinElmer Optoelectronics |
39 |
C30641G-DTC |
Large-area InGaAs photodiode. TE-cooler option, 2-stage TE cooler. |
PerkinElmer Optoelectronics |
40 |
C30641G-TC |
Large-area InGaAs photodiode. TE-cooler option, 1-stage TE cooler. |
PerkinElmer Optoelectronics |
41 |
C30642G-DTC |
Large-area InGaAs photodiode. TE-cooler option, 2-stage TE cooler. |
PerkinElmer Optoelectronics |
42 |
C30642G-TC |
Large-area InGaAs photodiode. TE-cooler option, 1-stage TE cooler. |
PerkinElmer Optoelectronics |
43 |
C30665G-DTC |
Large-area InGaAs photodiode. TE-cooler option, 2-stage TE cooler. |
PerkinElmer Optoelectronics |
44 |
C30665G-TC |
Large-area InGaAs photodiode. TE-cooler option, 1-stage TE cooler. |
PerkinElmer Optoelectronics |
45 |
C4877 |
High Performance Thermoelectric Coolers |
Hamamatsu Corporation |
46 |
C4878 |
High Performance Thermoelectric Coolers |
Hamamatsu Corporation |
47 |
C4880-80 |
Fast scan multi format Cooled CCD Camera |
Hamamatsu Corporation |
48 |
CK07 |
Heat sinks for screw components; air cooling |
Siemens |
49 |
CK08 |
Heat sinks for screw components; air cooling |
Siemens |
50 |
CK09 |
Heat sinks for screw components; air cooling |
Siemens |
51 |
CSD16323Q3C |
Dual Cool N-Channel NexFET Power MOSFET 8-VSON-CLIP -55 to 150 |
Texas Instruments |
52 |
CSD95372BQ5MC |
60A Synchronous Buck NexFET? Smart Power Stage with Dual Cool package 12-VSON-CLIP 0 to 0 |
Texas Instruments |
53 |
CSD95372BQ5MCT |
60A Synchronous Buck NexFET? Smart Power Stage with Dual Cool package 12-VSON-CLIP 0 to 0 |
Texas Instruments |
54 |
DESIGN GUIDE |
AMD Thermal, Mechanical, and Chassis Cooling Design Guide |
Advanced Micro Devices |
55 |
DIPF |
DIP F - 12 lead plastic split DIP with folded cooling tabs - Outline drawings |
SGS-ATES |
56 |
DIPG |
DIP G - 12 lead plastic split DIP with flat cooling tabs - Outline drawings |
SGS-ATES |
57 |
DK02 |
Heat sinks for screw components; air cooling |
Siemens |
58 |
DK03 |
Heat sinks for screw components; air cooling |
Siemens |
59 |
DK04 |
Heat sinks for screw components; air cooling |
Siemens |
60 |
EK02 |
Heat sinks for screw components; air cooling |
Siemens |
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