| No. |
Part Name |
Description |
Manufacturer |
| 31 |
LY101 |
CC/CV Controller IC Product |
Shenzhen StrongLink Electronics |
| 32 |
LY103 |
CC/CV Controller IC Product |
Shenzhen StrongLink Electronics |
| 33 |
LY321 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 34 |
LY324 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 35 |
LY358 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 36 |
LY8011 |
CC/CV Controller IC Product |
Shenzhen StrongLink Electronics |
| 37 |
LY8013 |
CC/CV Controller IC Product |
Shenzhen StrongLink Electronics |
| 38 |
LYS3211 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 39 |
LYS3213 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 40 |
LYS3215 |
Op Amp Controller IC Product |
Shenzhen StrongLink Electronics |
| 41 |
MC68175P |
MC68175 FLEXchip IC Product Preview |
Motorola |
| 42 |
MP-117 |
MP117 IC PACKAGE |
IPRS Baneasa |
| 43 |
MP-48 |
MP48 IC PACKAGE |
IPRS Baneasa |
| 44 |
MRFIC2408 |
Bluetooth External Power Amplifier IC Product Preview |
Motorola |
| 45 |
NCV8612B |
Ultra-Low Iq Automotive System Power Supply IC Power Saving Triple-Output Linear Regulator |
ON Semiconductor |
| 46 |
NCV8614 |
Ultra-Low Iq Automotive System Power Supply IC Power Saving Triple Output Linear Regulator |
ON Semiconductor |
| 47 |
PA2423 |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 48 |
PA2423G |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 49 |
PA2423G-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 50 |
PA2423L |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 51 |
PA2423L-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information |
SiGe Semiconductor |
| 52 |
PA2423MB |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information |
SiGe Semiconductor |
| 53 |
PA2423MB-EV |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information |
SiGe Semiconductor |
| 54 |
PACKAGE DIMENSIONS |
Plastic and Ceramic IC Packages from Samsung High Performance CMOS Logic Data Book 1988 |
Samsung Electronic |
| 55 |
PACKAGES |
Linear IC packages from 1971 Motorola Linear Integrated Circuits DATA BOOK first edition |
Motorola |
| 56 |
PACKAGES |
RCA Linear IC Packages and lead forms H1553, H1644, H1805, H1806, H1807, etc. |
RCA Solid State |
| 57 |
PACKAGES |
SIGNETICS IC PACKAGES: A, B, DA, DB, DC, DE, DF, FH, FJ, FN, IE, IEA, IH, IHA, IJ, IJA, IK, IKA, IM, IMA... XF |
Signetics |
| 58 |
PACKAGING |
INFORMATIONS about IC packages from Raytheon Linear Integrated Circuits Databook 1989 |
Raytheon |
| 59 |
PACKAGING |
Silicon Systems IC Packaging DIAGRAMS |
Silicon Systems |
| 60 |
PACKAGING |
INFORMATIONS about IC packaging from XICOR DATABOOK 1985 |
Xicor |
| | | |
