No. |
Part Name |
Description |
Manufacturer |
31 |
21-0076B |
PACKAGE OUTLINE, SC70, 5L |
MAXIM - Dallas Semiconductor |
32 |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD |
MAXIM - Dallas Semiconductor |
33 |
21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
34 |
21-0114B |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
35 |
21-0125A |
PACKAGE OUTLINE |
MAXIM - Dallas Semiconductor |
36 |
21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm |
MAXIM - Dallas Semiconductor |
37 |
21-0146 |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
38 |
21-0146A |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
39 |
21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm |
MAXIM - Dallas Semiconductor |
40 |
3D14A-P |
DIP-14 PIN OUTLINE DRAWING PACKAGE |
TOSHIBA |
41 |
3D16A-P |
DIP 16 PIN OUTLINE DRAWING PACKAGE |
TOSHIBA |
42 |
3D18A-P |
DIP 18 PIN OUTLINE DRAWING PACKAGE |
TOSHIBA |
43 |
3D8A-P |
DIP-8 PIN OUTLINE DRAWING PACKAGE |
TOSHIBA |
44 |
3PM |
CASE OUTLINES |
IPRS Baneasa |
45 |
40-05-015 |
Package Outline: 48 lead 300 mil SSOP |
SIMTEK |
46 |
40PT2 |
CASE OUTLINES |
IPRS Baneasa |
47 |
45PT2 |
CASE OUTLINES |
IPRS Baneasa |
48 |
48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE |
SMSC Corporation |
49 |
4PM |
CASE OUTLINES |
IPRS Baneasa |
50 |
4PTM2 |
CASE OUTLINES |
IPRS Baneasa |
51 |
60PT2 |
CASE OUTLINES |
IPRS Baneasa |
52 |
6D24A-P |
24 PIN Outline drawing Package |
TOSHIBA |
53 |
6D28A-P |
28-PIN Outline drawing Package |
TOSHIBA |
54 |
6D42A-P |
42 PIN Outline Drawing Package |
TOSHIBA |
55 |
6N137 |
Small Outline, 5 Lead, High CMR, High Speed, Logic Gate Optocouplers |
Agilent (Hewlett-Packard) |
56 |
8 LEAD CERDIP (JA) |
Package Outlines |
Intersil |
57 |
8 LEAD PLASTIC (PA) |
Package Outlines |
Intersil |
58 |
8 LEAD SOIC (BA) |
Package Outlines |
Intersil |
59 |
8 LEAD TO3 METAL CAN (KA) |
Package Outlines |
Intersil |
60 |
8SOIC |
8 PIN SOIC PACKAGE OUTLINE |
SMSC Corporation |
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