| No. |
Part Name |
Description |
Manufacturer |
| 31 |
21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm |
MAXIM - Dallas Semiconductor |
| 32 |
21-0146 |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 33 |
21-0146A |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 34 |
21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm |
MAXIM - Dallas Semiconductor |
| 35 |
40-05-015 |
Package Outline: 48 lead 300 mil SSOP |
SIMTEK |
| 36 |
48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE |
SMSC Corporation |
| 37 |
6N137 |
Small Outline, 5 Lead, High CMR, High Speed, Logic Gate Optocouplers |
Agilent (Hewlett-Packard) |
| 38 |
8 LEAD CERDIP (JA) |
Package Outlines |
Intersil |
| 39 |
8 LEAD PLASTIC (PA) |
Package Outlines |
Intersil |
| 40 |
8 LEAD SOIC (BA) |
Package Outlines |
Intersil |
| 41 |
8 LEAD TO3 METAL CAN (KA) |
Package Outlines |
Intersil |
| 42 |
8SOIC |
8 PIN SOIC PACKAGE OUTLINE |
SMSC Corporation |
| 43 |
CASE 1-03 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 44 |
CASE 1-05 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 45 |
CASE 11-03 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 46 |
CASE 152-02 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 47 |
CASE 197-01 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 48 |
CASE 221A-02 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 49 |
CASE 306-04 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 50 |
CASE 77-03 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 51 |
CASE 80-02 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 52 |
CASE 90-05 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 53 |
CASE D |
PACKAGE OUTLINE DRAWINGS |
Sprague |
| 54 |
CASE340 |
Case Outline Dimensions Motorola POWER databook 1980 |
Motorola |
| 55 |
CM8 |
8 LEAD TO8 Package Outlines |
PLESSEY Semiconductors |
| 56 |
CUSTOM NETWORKS (SURFACE MOUNT DIPS) |
Small Outline, Highly Stable Thick Film Resistors, Wide Operating Temperature Range (- 55°C to + 125°C), Surface Mount ""J"" Leads or Gull Wing Leads |
Vishay |
| 57 |
DC14 |
15 LEAD DILMON Package Outlines |
PLESSEY Semiconductors |
| 58 |
DG14 |
14 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 59 |
DG16 |
16 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 60 |
DG8 |
8 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| | | |
