DatasheetCatalog
  |   Home   |   All manufacturers   |   By Category   |  
FR DE ES IT PT RU

   
Quick jump to: 1N 2N 2SA 2SC 74 AD BA BC BD BF BU CXA HCF IRF KA KIA LA LM MC NE ST STK TDA TL UA
LM317 LM339 MAX232 NE555 LM324 8051 7805 2N3055 LM358 2N2222 74LS138 TDA7294 TL431 IRF540 1N4148

Datasheets for PB

Datasheets found :: 112
Page: | 1 | 2 | 3 | 4 |
No. Part Name Description Manufacturer
31 ISL6406 PWM, Single, Low Voltage, High Efficiency, Adjustable Output Voltage Min 0.8V, Input = 3.3V or 5V, Synchronizable. Available in Pb(Lead)-free, TSSOP (ISL6406IVZ, IVZ-T) Intersil
32 K4S280432F-UC 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
33 K4S280432F-UC75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
34 K4S280432F-UL75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
35 K4S280832F-UC75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
36 K4S280832F-UL75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
37 K4S281632F-UC60 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
38 K4S281632F-UC60/75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
39 K4S281632F-UC75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
40 K4S281632F-UL60 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
41 K4S281632F-UL60/75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
42 K4S281632F-UL75 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
43 K4S560432E-UC 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
44 K4S560432E-UC75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
45 K4S560432E-UL75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
46 K4S560832E-UC75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
47 K4S560832E-UL75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
48 K4S561632E-UC60 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
49 K4S561632E-UC75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
50 K4S561632E-UL60 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
51 K4S561632E-UL75 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Samsung Electronic
52 LM5068MM-1 V(dd): 100V; negative voltage hot swap controller. For -48V power modules, cental office switching, distributed power systems, electronic circuit breaker, PBX systems, negative power supply control National Semiconductor
53 LM5068MMX-1 V(dd): 100V; negative voltage hot swap controller. For -48V power modules, cental office switching, distributed power systems, electronic circuit breaker, PBX systems, negative power supply control National Semiconductor
54 MH88632B 0.3-7.0V; 14mA; central office interface circuit. For PBX, key telephone system, terminal equipment, digital loop carrier, wireless local loop Mitel Semiconductor
55 MH89625C-5 0.3-7.0V; OPS/DID PCM SLIC. For off premise digital PBX line cards, DID (direct inward dial) line cards, PABX, key systems, central office equipment Mitel Semiconductor
56 MH89625C-6 0.3-7.0V; OPS/DID PCM SLIC. For off premise digital PBX line cards, DID (direct inward dial) line cards, PABX, key systems, central office equipment Mitel Semiconductor
57 MT89790B 0.3-7.0V; 40mA; CEPT PCM 30/CRC-4 framer & interface circuit. For primary rate ISDN network nodes, multiplexing equipment, private network: PBX to PBX links Mitel Semiconductor
58 MT89790B 0.3-7.0V; 40mA; CEPT PCM 30/CRC-4 framer & interface circuit. For primary rate ISDN network nodes, multiplexing equipment, private network: PBX to PBX links Mitel Semiconductor
59 MT89790BN 0.3-7.0V; 40mA; CEPT PCM 30/CRC-4 framer & interface circuit. For primary rate ISDN network nodes, multiplexing equipment, private network: PBX to PBX links Mitel Semiconductor
60 MT89790BN 0.3-7.0V; 40mA; CEPT PCM 30/CRC-4 framer & interface circuit. For primary rate ISDN network nodes, multiplexing equipment, private network: PBX to PBX links Mitel Semiconductor


Datasheets found :: 112
Page: | 1 | 2 | 3 | 4 |



© 2024 - www Datasheet Catalog com