| No. |
Part Name |
Description |
Manufacturer |
| 31 |
DP14 |
14 LEAD PLASTIC DIL |
PLESSEY Semiconductors |
| 32 |
DP14 |
14 LEAD PLASTIC DIL PACKAGE |
PLESSEY Semiconductors |
| 33 |
DP14 |
14 LEAD PLASTIC DIL Package Outlines |
PLESSEY Semiconductors |
| 34 |
F14C |
14 Lead Ceramic Flatpack |
National Semiconductor |
| 35 |
J14A |
14 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 36 |
M14A |
14 Lead (0.150 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 37 |
M14B |
14 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 38 |
M14D |
14 Lead (0.300 in. Wide) Molded Small Outline Package, EIAJ |
National Semiconductor |
| 39 |
MAX9160 |
LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver |
MAXIM - Dallas Semiconductor |
| 40 |
MAX9160AEUI |
LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver |
MAXIM - Dallas Semiconductor |
| 41 |
MAX9160EGJ |
3.0 V to 3.6 V, LVDS or LVTTL/LVCMOS input to 14 LVTTL/LVCMOS output clock driver |
MAXIM - Dallas Semiconductor |
| 42 |
MAX9160EUI |
LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver |
MAXIM - Dallas Semiconductor |
| 43 |
MAX9160EUI+ |
LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver |
MAXIM - Dallas Semiconductor |
| 44 |
MAX9160EUI+T |
LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver |
MAXIM - Dallas Semiconductor |
| 45 |
MCP6544 |
The MCP6544 is a Push-pull, quad comparator. This single-ended device operates from 1.6V to 5.5V, with typical quiescent current of 600 nA and a maximum of 1 microamp. This device is offered in the 16 lead PDIP, SOIC and 14 lead TSSOP pack |
Microchip |
| 46 |
MKT-D14D |
DIP, SIDEBRAZED CERAMIC 14 LEAD |
National Semiconductor |
| 47 |
MPC9774 |
3.3V 1:14 LVCMOS PLL Clock Generatorzer |
Freescale (Motorola) |
| 48 |
MPC9774 |
3.3V/2.5V 1:14 LVCMOS PLL Clock Generator |
Motorola |
| 49 |
MPC97H74 |
3.3V 1:14 LVCMOS PLL Clock Generatorzer |
Freescale (Motorola) |
| 50 |
MTC14 |
14 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 51 |
N14A |
14 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 52 |
PACKAGES |
14 Lead CERDIP, 14 Lead Plastic DIP, 14 Lead Side Braze DIP, 20 Lead PLCC packages |
Siliconix |
| 53 |
PACKAGES |
14 Lead CERDIP, 14 Lead Plastic DIP, 14 Lead Side Braze DIP, 20 Lead PLCC packages |
Siliconix |
| 54 |
PACKAGES |
14 Lead CERDIP, 14 Lead Plastic DIP, 14 Lead Side Braze DIP, 20 Lead PLCC packages |
Siliconix |
| 55 |
QP14 |
14 LEAD Q.I.L. |
PLESSEY Semiconductors |
| 56 |
SO14 |
SO-14 - 14 lead plasic micropackage - Outline drawings |
SGS-ATES |
| 57 |
UCC5628FQP |
14 Line 2.7- 5V Multimode Terminator for SCSI through Ultra320 SCSI |
Texas Instruments |
| 58 |
UCC5628FQP/81540 |
14 Line 2.7- 5V Multimode Terminator for SCSI through Ultra320 SCSI 48-LQFP |
Texas Instruments |
| 59 |
UCC5628FQPG4 |
14 Line 2.7- 5V Multimode Terminator for SCSI through Ultra320 SCSI 48-LQFP 0 to 70 |
Texas Instruments |
| 60 |
UCC5628FQPTR |
14 Line 2.7- 5V Multimode Terminator for SCSI through Ultra320 SCSI |
Texas Instruments |
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