| No. |
Part Name |
Description |
Manufacturer |
| 31 |
J40A |
40 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 32 |
J40AQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 33 |
J40BQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 34 |
M40A |
40 Lead (0.300 in. Wide) Molded Very Small Outline Package |
National Semiconductor |
| 35 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
| 36 |
N40A |
40 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 37 |
TP40A |
40 Lead Molded TapePak |
National Semiconductor |
| 38 |
W541L240 |
W541C240 Low Voltage version |
Winbond Electronics |
| 39 |
W741L241F |
4-Bit Microcontroller W741L240 Low Power Version |
Winbond Electronics |
| 40 |
W741L241H |
4-Bit Microcontroller W741L240 Low Power Version |
Winbond Electronics |
| | | |
