| No. |
Part Name |
Description |
Manufacturer |
| 31 |
H04A |
4 Lead (0.100 in. Diameter P.C.) TO-46 Metal Can Package |
National Semiconductor |
| 32 |
H04C |
4 Lead (0.100 in. Diameter P.C.) TO-72 Metal Can Package |
National Semiconductor |
| 33 |
H04D |
4 Lead (0.100 in. Diameter P.C.) Shielded TO-46 Metal Can Package |
National Semiconductor |
| 34 |
H06C |
6 Lead (0.200 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 35 |
H08A |
8 Lead (0.230 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 36 |
H08B |
8-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 37 |
H08C |
8 Lead (0.200 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 38 |
H08D |
8-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 39 |
H10C |
10 Lead (0.230 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 40 |
H10F |
10-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 41 |
H10G |
10-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 42 |
H12B |
12-Lead (0.400 In. Square Pattern) TO-8 Metal Can Package |
National Semiconductor |
| 43 |
HA04E |
4 Lead (0.200 in. Diameter P.C.) TO-39 Metal Can Package |
National Semiconductor |
| 44 |
K02A |
2 Lead TO-3 Metal Can Package |
National Semiconductor |
| 45 |
K02B |
2 Lead (0.060 in. Lead Diameter) TO-3 Metal Can Package |
National Semiconductor |
| 46 |
K02C |
2 Lead TO-3 Metal Can Package, Low Profile |
National Semiconductor |
| 47 |
K04A |
4 Lead TO-3 Metal Can Package |
National Semiconductor |
| 48 |
K08A |
8 Lead TO-3 Metal Can Package |
National Semiconductor |
| 49 |
KA04B |
4 Lead TO-3 Metal Can Package, Low Profile |
National Semiconductor |
| 50 |
KA15A |
15 Lead TO-3 Metal Can Package |
National Semiconductor |
| 51 |
KC02A |
2 Lead TO-3 Metal Can Package, Aluminum |
National Semiconductor |
| 52 |
L99PM72GXP |
Advanced power management system IC with embedded LIN and high speed CAN transceiver supporting CAN Partial Networking |
ST Microelectronics |
| 53 |
L99PM72GXPTR |
Advanced power management system IC with embedded LIN and high speed CAN transceiver supporting CAN Partial Networking |
ST Microelectronics |
| 54 |
L99PM72PXP |
Advanced power management IC, with embedded LIN and HS CAN transceiver, supporting CAN Partial Networking |
ST Microelectronics |
| 55 |
L99PM72PXPTR |
Advanced power management IC, with embedded LIN and HS CAN transceiver, supporting CAN Partial Networking |
ST Microelectronics |
| 56 |
MKT-H04D |
4 LEAD.100 DIA P.C.SHIELDED METAL CAN PACKAGE (H) |
National Semiconductor |
| 57 |
NN3478FAS-A |
Video signal processor MCP IC for Soutch American PAL system |
Panasonic |
| 58 |
NX5304 |
NECs 1310 nm InGaAsP MQW-FP LASER DIODE IN CAN PACKAGE |
NEC |
| 59 |
NX5304EH |
NECs 1310 nm InGaAsP MQW-FP LASER DIODE IN CAN PACKAGE |
NEC |
| 60 |
NX5304EK |
NECs 1310 nm InGaAsP MQW-FP LASER DIODE IN CAN PACKAGE |
NEC |
| | | |
