No. |
Part Name |
Description |
Manufacturer |
31 |
CSC3281RF |
TO-3P Fully Isolated Plastic Package Transistor CDIL |
Continental Device India Limited |
32 |
CSD1047F |
TO-3P Fully Isolated Plastic Package Transistor CDIL |
Continental Device India Limited |
33 |
CSD1047QF |
TO-3P Fully Isolated Plastic Package Transistor CDIL |
Continental Device India Limited |
34 |
CSD1047YF |
TO-3P Fully Isolated Plastic Package Transistor CDIL |
Continental Device India Limited |
35 |
CSD1426F |
TO-3P Fully Isolated Plastic Package Transistor CDIL |
Continental Device India Limited |
36 |
FO-57C |
FO57C Package Dimensions Mecanical Data |
Philips |
37 |
IC PACKAGES |
Ceramic package 68 pins, C-CC, 88 pins, PGA |
Siemens |
38 |
IC PACKAGES |
Plastic package 44 pins, PLCC, 68 pins, PLCC |
Siemens |
39 |
IC PACKAGES |
Plastic plug-in Package 20 B 40 DIN 41866 40 pins, DIP, Miniature plastic package (G) 20 pins (SO20L) |
Siemens |
40 |
IC PACKAGES |
Miniature plastic package (SMD) 14 pins (SO14), 20 pins (SO20L) |
Siemens |
41 |
IC PACKAGES |
Miniature plastic package 6 pins, 8 pins, SMD 6 pins (similar to SO6), 8 pins (similar to SO8) |
Siemens |
42 |
IC PACKAGES |
Plastic Package Outlines, P-DIP, 4, 6 8, 14 pins, 20A DIN 41866 |
Siemens |
43 |
IR21531S |
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase |
International Rectifier |
44 |
IR21531SPBF |
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase |
International Rectifier |
45 |
IR2153DS |
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 1.2us Deadtime in a 8-lead SOIC package with bootstrap diode |
International Rectifier |
46 |
IR2153DSPBF |
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 1.2us Deadtime in a 8-lead SOIC package with bootstrap diode |
International Rectifier |
47 |
IRF9395M |
A -30V Dual P-Channel HEXFET Power MOSFET in a DirectFET MC package rated at -14 amperes optimized with low on resistance |
International Rectifier |
48 |
IRF9395MTR1PBF |
A -30V Dual P-Channel HEXFET Power MOSFET in a DirectFET MC package rated at -14 amperes optimized with low on resistance |
International Rectifier |
49 |
IRF9395MTRPBF |
A -30V Dual P-Channel HEXFET Power MOSFET in a DirectFET MC package rated at -14 amperes optimized with low on resistance |
International Rectifier |
50 |
IRGP4063D |
600V UltraFast Copack Trench IGBT in a TO-247AC package for apliance motion applications |
International Rectifier |
51 |
IRGP4063D-EPBF |
600V UltraFast Copack Trench IGBT in a TO-247AC package for apliance motion applications |
International Rectifier |
52 |
KGF1283 |
Power FET (Plastic Package Type) |
OKI electronic components |
53 |
KGF1283 |
Power FET (Plastic Package Type) |
OKI electronic eomponets |
54 |
KGF1284 |
Power FET (Plastic Package Type) |
OKI electronic components |
55 |
KGF1284 |
Power FET (Plastic Package Type) |
OKI electronic eomponets |
56 |
KGF1305T |
Power FET (Ceramic Package Type) |
OKI electronic components |
57 |
KGF1305T |
Power FET (Ceramic Package Type) |
OKI electronic eomponets |
58 |
KGF1312 |
Power FET (plastic package type) |
OKI electronic components |
59 |
KGF1313 |
Power FET (Plastic Package Type) |
OKI electronic components |
60 |
KGF1313 |
Power FET (Plastic Package Type) |
OKI electronic eomponets |
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