No. |
Part Name |
Description |
Manufacturer |
31 |
SPP02N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
32 |
SPP04N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
33 |
SPP06N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
34 |
SPP08N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
35 |
SPP11N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
36 |
SPP17N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
37 |
SPW11N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
38 |
SPW17N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
39 |
U0402FC3.3C |
3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
40 |
U0404FC3.3C |
3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
41 |
U0406FC3.3C |
3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
42 |
U0408FC3.3C |
3.3V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
43 |
ULC0402FC3.3C |
3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
44 |
ULC0404FC3.3C |
3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
45 |
ULC0406FC3.3C |
3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
46 |
ULC0408FC3.3C |
3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
47 |
ULLC0402FC3.3C |
3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
48 |
ZMC3.0 |
Surface mount Zener Diodes |
Diotec Elektronische |
49 |
ZMC3.3 |
Surface mount Zener Diodes |
Diotec Elektronische |
50 |
ZMC3.6 |
Surface mount Zener Diodes |
Diotec Elektronische |
51 |
ZMC3.9 |
Surface mount Zener Diodes |
Diotec Elektronische |
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