| No. |
Part Name |
Description |
Manufacturer |
| 31 |
BH76909GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 32 |
BH76909GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 33 |
BH76912GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 34 |
BH76912GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 35 |
BH76916GU |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 36 |
BH76916GU-E2 |
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers |
ROHM |
| 37 |
CASE D |
PACKAGE OUTLINE DRAWINGS |
Sprague |
| 38 |
CM8 |
8 LEAD TO8 Package Outlines |
PLESSEY Semiconductors |
| 39 |
DC14 |
15 LEAD DILMON Package Outlines |
PLESSEY Semiconductors |
| 40 |
DG14 |
14 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 41 |
DG16 |
16 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 42 |
DG8 |
8 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 43 |
DO-35 |
DO35 Package Outlines |
Newmarket Transistors NKT |
| 44 |
DO-7 |
DO7 Package Outlines |
Newmarket Transistors NKT |
| 45 |
DP14 |
14 LEAD PLASTIC DIL Package Outlines |
PLESSEY Semiconductors |
| 46 |
DP8 |
8 LEAD PLASTIC DIL Package Outlines |
PLESSEY Semiconductors |
| 47 |
HCS101 |
The HCS101 is a fixed code encoder designed for remote control systems. Its small package outline and low cost make this device a perfect solution for unidirectional remote control systems. The HCS101 is pin compatible with Microchip’ |
Microchip |
| 48 |
HCS200 |
The HCS200 is a code hopping encoder designed for Remote Keyless Entry (RKE) systems. The HCS200 utilizes Microchip’s patented KEELOQ® code hopping technology, which incorporates high security, a small package outline and low co |
Microchip |
| 49 |
HCS201 |
The HCS201 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS201 utilizes Microchip’s patented KEELOQ® code hopping technology, which incorporates high security, a small package outline and |
Microchip |
| 50 |
HCS300 |
The HCS300 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS300 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline and low |
Microchip |
| 51 |
HCS301 |
The HCS301 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS301 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 52 |
HCS320 |
The HCS320 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS320 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 53 |
HCS360 |
The HCS360 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS360 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 54 |
HCS361 |
The HCS361 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS361 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 55 |
HCS362 |
The HCS362 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS362 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 56 |
HCS365 |
The HCS365 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS365 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 57 |
HCS370 |
The HCS370 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS370 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 58 |
IC PACKAGES |
Plastic Package Outlines, P-DIP, 4, 6 8, 14 pins, 20A DIN 41866 |
Siemens |
| 59 |
ICS280 |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 60 |
ICS280PG |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
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