No. |
Part Name |
Description |
Manufacturer |
31 |
CD40105BE |
CMOS 4-Bit-by-16-Word FIFO Register |
Texas Instruments |
32 |
CD40105BF |
CMOS 4-Bit-by-16-Word FIFO Register |
Texas Instruments |
33 |
CD40105BF3A |
CMOS 4-Bit-by-16-Word FIFO Register |
Texas Instruments |
34 |
CD40105BF3AS2283 |
CMOS 4-Bit-by-16-Word FIFO Register 16-CDIP |
Texas Instruments |
35 |
CH7301A-T-B |
Chrontel CH7301 DVI Output Device |
Chrontel |
36 |
CM10MD1-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
37 |
CM10MD3-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
38 |
CM15MD1-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
39 |
CM15MD3-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
40 |
CM20MD1-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
41 |
CM20MD3-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
42 |
CM30MD1-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
43 |
CM30MD3-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
44 |
CM50MD1-12H |
MITSUBISHI IGBT MODULES MEDIUM POWER SWITCHING USE FLAT-BASE TYPE, INSULATED TYPE |
Mitsubishi Electric Corporation |
45 |
CMX264 |
Frequency Domain Split-Band Scrambler |
MXCOM |
46 |
CMX264D5 |
Frequency domain split-band scrambler |
MXCOM |
47 |
FASTCARD 2 |
FDDI PC/AT-Based SUPERNET 2 Technology Card (FASTcard), Dual Attachment Concentrator Board Set and Software Package |
Advanced Micro Devices |
48 |
HD100122 |
9-but-Buffers |
Hitachi Semiconductor |
49 |
HD100122F |
9-but-Buffers |
Hitachi Semiconductor |
50 |
HK02 |
Heat sinks for screw and flat-bottom components; air cooling |
Siemens |
51 |
HK05 |
Heat sinks for screw and flat-bottom components; air cooling |
Siemens |
52 |
HK08 |
Heat sinks for screw and flat-bottom components; air cooling |
Siemens |
53 |
HK15 |
Heat sinks for screw and flat-bottom components; air cooling |
Siemens |
54 |
HM5225165BLTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
55 |
HM5225165BTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
56 |
HM5225405BLTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
57 |
HM5225405BTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
58 |
HM5225805BLTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
59 |
HM5225805BTT-B6 |
256M LVTTL interface SDRAM 133 MHz/100 MHz 4-Mword � 16-bit � 4-bank/8-Mword � 8-bit � 4-bank /16-Mword � 4-bit � 4-bank PC/133, PC/100 SDRAM |
Elpida Memory |
60 |
HM5264165FLTT-B60 |
64M LVTTL interface SDRAM 133 MHz/100 MHz |
Hitachi Semiconductor |
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