No. |
Part Name |
Description |
Manufacturer |
3301 |
TUSB1211A1ZRQR |
High Speed 480 Mbps USB 2.0 OTG Transceiver with BC 1.2 Support 36-BGA MICROSTAR JUNIOR -40 to 85 |
Texas Instruments |
3302 |
TZA3019 |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3303 |
TZA3019AHT |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3304 |
TZA3019AV |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3305 |
TZA3019AVH |
2.5 Gbits/s dual postamplifier with level detector and 2 x 2 switch |
Philips |
3306 |
TZA3019BHT |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3307 |
TZA3019BV |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3308 |
TZA3019BVH |
2.5 Gbits/s dual postamplifier with level detector and 2 x 2 switch |
Philips |
3309 |
TZA3019CHT |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3310 |
TZA3019CV |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3311 |
TZA3019CVH |
2.5 Gbits/s dual postamplifier with level detector and 2 x 2 switch |
Philips |
3312 |
TZA3019U |
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
Philips |
3313 |
U22 SMD |
Marking for NE73430 part number, 30 NEC (SOT323) package, or NE73433 part number with 33 NEC (SOT23) package |
NEC |
3314 |
U72 SMD |
Marking for NE25139 part number, 39 NEC (SOT143) package |
NEC |
3315 |
UPG502B |
5 GHz Divide-by-2 static prescaler |
NEC |
3316 |
UPG502P |
5 GHz Divide-by-2 static prescaler |
NEC |
3317 |
UT6164C32 |
64K X 32 SYNCHRONOUS PIPELINED BURST CMOS SRAM |
UTRON Technology |
3318 |
UT6164C32Q-6 |
64K X 32 SYNCHRONOUS PIPELINED BURST CMOS SRAM |
UTRON Technology |
3319 |
UT6164C32T-6 |
64K X 32 SYNCHRONOUS PIPELINED BURST CMOS SRAM |
UTRON Technology |
3320 |
UT84520 |
PS/2 SCROLLING MOUSE CONTROLLER |
Unisonic Technologies |
3321 |
UT8R128K32-15WCA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
3322 |
UT8R128K32-15WCC |
128K x 32 SRAM. 15ns access time. Lead finish gold. |
Aeroflex Circuit Technology |
3323 |
UT8R128K32-15WCX |
128K x 32 SRAM. 15ns access time. Lead finish factory option. |
Aeroflex Circuit Technology |
3324 |
UT8R128K32-15WPC |
128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. |
Aeroflex Circuit Technology |
3325 |
UT8R128K32-15WWA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
3326 |
UT8R128K32-15WWC |
128K x 32 SRAM. 15ns access time. Lead finish gold. |
Aeroflex Circuit Technology |
3327 |
UT8R128K32-15WWX |
128K x 32 SRAM. 15ns access time. Lead finish factory option. |
Aeroflex Circuit Technology |
3328 |
V54C333322V |
200/183/166 MHz 3.3 VOLT ULTRA HIGH PERFORMANCE 1M X 32 SDRAM 2 BANKS X 512Kbit X 32 |
Mosel Vitelic Corp |
3329 |
V54C333322V-5 |
3.3V ultra-high performance 1M x 32 SDRAM 2 banks x 512Kbit x 32 |
Mosel Vitelic Corp |
3330 |
V54C333322V-55 |
3.3V ultra-high performance 1M x 32 SDRAM 2 banks x 512Kbit x 32 |
Mosel Vitelic Corp |
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