No. |
Part Name |
Description |
Manufacturer |
3301 |
NN5118160BLTT-40 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3302 |
NN5118160BLTT-50 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3303 |
NN5118160BLTT-60 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3304 |
NN5118160BRR-40 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3305 |
NN5118160BRR-50 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3306 |
NN5118160BRR-60 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3307 |
NN5118160BTT-40 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3308 |
NN5118160BTT-50 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3309 |
NN5118160BTT-60 |
CMOS 1M x 16BIT DYNAMIC RAM |
etc |
3310 |
NTE1816 |
Integrated Circuit Module, Dual AF PO, 6W/Ch Dual Power Supplies Req�d |
NTE Electronics |
3311 |
NTE8167 |
Thermal cut-off (thermal fuse). |
NTE Electronics |
3312 |
NTMS4816N |
Power MOSFET, 30 V, 11 A, N-Channel |
ON Semiconductor |
3313 |
NX8570SC816D-BA |
4 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (20 mW min). FC-PC connector. |
NEC |
3314 |
NX8570SC816D-CA |
4 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (20 mW min). SC-PC connector. |
NEC |
3315 |
NX8570SC816Q-BA |
8 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (20 mW min). FC-PC connector. |
NEC |
3316 |
NX8571SC816D-BA |
4 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (10 mW min). FC-PC connector. |
NEC |
3317 |
NX8571SC816D-CA |
4 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (10 mW min). SC-PC connector. |
NEC |
3318 |
NX8571SC816Q-BA |
8 x 50 GHz tunable CW InGaAsP MQW-DFB laser diode module with wavelength monitor for DWDM applications (10 mW min).FC-PC connector. |
NEC |
3319 |
OPB816 |
Slotted Op tical Switch |
Optek Technology |
3320 |
P1P8160A |
Low Jitter Clock Generator and Peak EMI Reduction IC |
ON Semiconductor |
3321 |
P3P8163A |
Spread Spectrum Peak EMI Reduction Device, LVCMOS, 3.3 V |
ON Semiconductor |
3322 |
P3P816711A |
Spread Spectrum Peak EMI Reduction Device |
ON Semiconductor |
3323 |
PC816 |
Hgh -w=der Vtige/ Hgh Density Mounting Type Photocoupler |
SHARP |
3324 |
PC816-SERIES |
High Collector-emitter Voltage, High Density Mounting Type Photocoupler |
SHARP |
3325 |
PC816A |
High collector-emitter voltage,high density mounting type photocoupler |
SHARP |
3326 |
PC816AB |
Hgh -w=der Vtige/ Hgh Density Mounting Type Photocoupler |
SHARP |
3327 |
PC816AC |
Hgh -w=der Vtige/ Hgh Density Mounting Type Photocoupler |
SHARP |
3328 |
PC816AD |
High collector-emitter voltage,high density mounting type photocoupler |
SHARP |
3329 |
PC816B |
High collector-emitter voltage,high density mounting type photocoupler |
SHARP |
3330 |
PC816BC |
Hgh -w=der Vtige/ Hgh Density Mounting Type Photocoupler |
SHARP |
| | | |