| No. |
Part Name |
Description |
Manufacturer |
| 331 |
ERJMS4HF5M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 332 |
ERJMS4HF6M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 333 |
ERJMS4HF7M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 334 |
ERJMS4HF8M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 335 |
ERJMS4HF9M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 336 |
ERJMS4SF1M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 337 |
ERJMS4SF1M5U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 338 |
ERJMS4SF2M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 339 |
ERJMS4SF2M2U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 340 |
ERJMS4SF2M5U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 341 |
ERJMS4SF3M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 342 |
ERJMS4SF4M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB |
Panasonic |
| 343 |
ERJMS6SF1M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS6S |
Panasonic |
| 344 |
ERJMS6SF2M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS6S |
Panasonic |
| 345 |
ERJMS6SF3M0U |
Current Sensing Chip Resistors, Metal Plate Type-MS6S |
Panasonic |
| 346 |
ERJMS6SFM50U |
Current Sensing Chip Resistors, Metal Plate Type-MS6S |
Panasonic |
| 347 |
H7468 |
Metal Packege PMT with Internal Charge Amp+ADC Type |
Hamamatsu Corporation |
| 348 |
H7468-01 |
Metal Packege PMT with Internal Charge Amp+ADC Type |
Hamamatsu Corporation |
| 349 |
H7468-03 |
Metal Packege PMT with Internal Charge Amp+ADC Type |
Hamamatsu Corporation |
| 350 |
H7468-20 |
Metal Packege PMT with Internal Charge Amp+ADC Type |
Hamamatsu Corporation |
| 351 |
IC PACKAGES |
Plastic power packages with cooling fin and 9 pins, SIP, Metal package 5 J 10 DIN 41873 (similar to TO100) |
Siemens |
| 352 |
IRFY330 |
N-Channel MOSFET in a Hermetically sealed TO257AB Metal Package |
SemeLAB |
| 353 |
L4100 |
Resin-potted metal package LED |
Hamamatsu Corporation |
| 354 |
MC1709CG |
Operational Amplifier metal package TO-99 |
Motorola |
| 355 |
MC1709G |
Operational Amplifier metal package TO-99 |
Motorola |
| 356 |
MJ14000 |
Bipolar NPN Device in a Hermetically sealed TO3 Metal Package |
SemeLAB |
| 357 |
MJ2253 |
Bipolar PNP Device in a Hermetically sealed TO66 Metal Package. |
SemeLAB |
| 358 |
MJ3101 |
Bipolar NPN Device in a Hermetically sealed TO66 Metal Package. |
SemeLAB |
| 359 |
MJ3202 |
Bipolar NPN Device in a Hermetically sealed TO66 Metal Package |
SemeLAB |
| 360 |
MJ8100 |
Bipolar PNP Device in a Hermetically sealed TO39 Metal Package. |
SemeLAB |
| | | |
