| No. |
Part Name |
Description |
Manufacturer |
| 331 |
FH16H-50S-0.5SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 332 |
FH16M-80S-0.4SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 333 |
FH16M-96S-0.4SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 334 |
FH16P-64S-0.5SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 335 |
GC5318 |
High Density Digital Up Converter 388-BGA -40 to 85 |
Texas Instruments |
| 336 |
GC5318IZED |
High Density Digital Up Converter 388-BGA -40 to 85 |
Texas Instruments |
| 337 |
GST/ST19WG34AW40 |
Smartcard MCU With 18, 34, 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 338 |
GST/ST19WG66AW40 |
Smartcard MCU With 18, 34, 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 339 |
GST/ST19WI18AW40 |
Smartcard MCU With Modular Arithmetic Processor, I2C & 18 Kbytes High Density EEPROM |
ST Microelectronics |
| 340 |
GST/ST19WL18AW40 |
Smartcard MCU With Modular Arithmetic Processor & 18 Kbytes High Density EEPROM |
ST Microelectronics |
| 341 |
GST/ST19WL34AW40 |
Smartcard MCU with MAP & 34 Kbytes High Density EEPROM |
ST Microelectronics |
| 342 |
GST/ST19WL66AW40 |
Smartcard MCU with Modular Arithmetic Processor & 34 or 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 343 |
GST/ST19WM18AW40 |
Smartcard MCU With 18, 34, 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 344 |
GST/ST19WM34AW40 |
Smartcard MCU With 18, 34, 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 345 |
GST/ST19WR66AW40 |
Dual Contactless Smartcard MCU with MAP, RF UART, IART & 66 Kbytes High Density EEPROM |
ST Microelectronics |
| 346 |
GST/ST19XL34AW40 |
Smartcard MCU With Modular Arithmetic Processor & 34 Kbytes High Density EEPROM |
ST Microelectronics |
| 347 |
GST/ST19XR34AW40 |
Dual Contactless Smartcard MCU With Modular Arithmetic Processor & 34 Kbytes High Density EEPROM |
ST Microelectronics |
| 348 |
GST/ST19XT34AW40 |
Smartcard MCU with MAP, USB/ISO Interface & 34 Kbytes High Density EEPROM |
ST Microelectronics |
| 349 |
GWX-15 |
Miniature size for high density applications |
etc |
| 350 |
GWX-26 |
Miniature size for high density applications |
etc |
| 351 |
GWX-26/A |
Miniature size for high density applications |
etc |
| 352 |
GWX-38 |
Miniature size for high density applications |
etc |
| 353 |
HCPL-814-00AE |
AC Input Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 354 |
HCPL-814-060E |
AC Input Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 355 |
HCPL-814-300E |
AC Input Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 356 |
HCPL-814-500E |
AC Input Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 357 |
HCPL-814-W00E |
AC Input Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 358 |
HCPL-817-00A |
Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 359 |
HCPL-817-00B |
Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| 360 |
HCPL-817-00C |
Phototransistor Optocoupler High Density Mounting Type |
Agilent (Hewlett-Packard) |
| | | |
