| No. |
Part Name |
Description |
Manufacturer |
| 3661 |
TOSHIBA ACCESSORIES |
Heat sinks, flat washers, spring lock washers, nuts, machine screw, clamps,mica insulators, mounting details |
TOSHIBA |
| 3662 |
TPT5609-A |
TO-92L Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3663 |
TPT5609-B |
TO-92L Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3664 |
TPT5609-C |
TO-92L Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3665 |
TRPGP40ATGC |
TRPGP40ATGC 12-mm Low-Frequency Glass-Encapsulated Transponder CCT 0-RFIDT |
Texas Instruments |
| 3666 |
TRPGP40TGC |
12-mm Low-Frequency Glass-Encapsulated Transponder CCT 0-RFIDT -25 to 70 |
Texas Instruments |
| 3667 |
TRPGR30ATGA |
23-mm Low-Frequency Glass-Encapsulated Transponder R/O 0-RFIDT -25 to 70 |
Texas Instruments |
| 3668 |
TRPGR30ATGB |
32-mm LF Glass Encapsulated Transponder, RO 0-RFIDT -25 to 70 |
Texas Instruments |
| 3669 |
TRPGR30ATGC |
TRPGR30ATGC 12-mm Low-Frequency Glass-Encapsulated Transponder, Read Only 0-RFIDT -25 to 85 |
Texas Instruments |
| 3670 |
TRPGR30ENATGA |
23-mm LF Glass-Encapsulated Transponder R/O, EN 14803 Numbering 0-RFIDT -25 to 70 |
Texas Instruments |
| 3671 |
TRPGR30ENATGB |
32-mm LF Glass-Encapsulated Transponder R/O, EN 14803 Numbering 0-RFIDT -25 to 70 |
Texas Instruments |
| 3672 |
TRPGR30TGC |
12-mm Low-Frequency Glass-Encapsulated Transponder, Read Only 0-RFIDT -25 to 85 |
Texas Instruments |
| 3673 |
U1160 |
small Photocell Glass encapsulated housing |
PerkinElmer Optoelectronics |
| 3674 |
UMG3N |
SOT-353 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3675 |
UML2N |
SOT-353 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3676 |
UML6N |
SOT-353 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3677 |
UMT1N |
SOT-363 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3678 |
UMX18N |
SOT-363 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3679 |
UMX1N |
SOT-363 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3680 |
UMX3N |
SOT-363 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3681 |
UMY1N |
SOT-353 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3682 |
UMZ1N |
SOT-363 Plastic-Encapsulate Biploar Transistors |
Micro Commercial Components |
| 3683 |
VCS101, 103 & 401 |
Uninsulated Element |
Vishay |
| 3684 |
W6NXD0K-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3685 |
W6NXD0KLSR-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3686 |
W6NXD3J-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3687 |
W6NXD3K-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3688 |
W6NXD3L-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3689 |
W6PXD3O-0000 |
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition |
CREE POWER |
| 3690 |
WSC - WSN |
Precision Power, Molded Thermoplastic Encapsulation, Available in Non-Inductive Styles with Aryton Perry Windings (WSN2515 or WSN4527) |
Vishay |
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