No. |
Part Name |
Description |
Manufacturer |
3751 |
U84C |
84 Pin Ceramic Pin Grid Array |
National Semiconductor |
3752 |
U99A |
99 Pin Ceramic Pin Grid Array |
National Semiconductor |
3753 |
VITRAMON - CASSETTE PACKAGED CAPS |
Monolithic Ceramic Chip Capacitors, Increased Pick and Place Productivity, Reduced Storage Area Required, Reduced Packaging Waste, Anti-Static and Reusable Cassette Cases |
Vishay |
3754 |
VJ0612 (LOW INDUCTANCE) |
Multilayer Ceramic Chip Capacitors, Low Inductance, Reduces AC Noise in Multi-Chip Modules (MCM), Low Profile, Robust Device for Easy Mounting |
Vishay |
3755 |
VJ0612 VTOP |
Multilayer Ceramic Chip Capacitors, Low inductance, Reduces AC noise in multi-chip modules (MCM) |
Vishay |
3756 |
VJ0805Y223XXX |
Multilayer Ceramic Chip Capacitors |
Vishay |
3757 |
VKO |
Ceramic AC Capacitors, Class X1, 440VAC / Class Y2, 300VAC |
Vishay |
3758 |
VKP |
Ceramic AC Capacitors, Class X1, 760VAC / Class Y1, 500VAC |
Vishay |
3759 |
W |
Surface Mount Chip NTC Thermistors, Top and Bottom Surface Terminations, High-Density Monolithic Ceramic Construction Packaging |
Vishay |
3760 |
W1X |
Ceramic Disc Capacitors, Class X1, 275VAC |
Vishay |
3761 |
WKP |
Ceramic AC Capacitors, Class X1, 760VAC / Class Y1, 500VAC |
Vishay |
3762 |
WYO |
Ceramic AC Capacitors, Class X1, 440VAC / Class Y2, 250VAC |
Vishay |
3763 |
X7R / X7S DIELECTRIC |
Multilayer Ceramic Chip Capacitors, Ideal for Decoupling and Filtering, General Purpose Dielectric, Excellent Aging Characteristics, Wide Range of Case Sizes, Voltage Ratings and Capacitance Values |
Vishay |
3764 |
X7R DIELECTRIC, HIGH VOLTAGE |
Multilayer Ceramic Chip Capacitors, High Voltage Ratings, Low ESR, Ideal for Surge Suppression and High Voltage Applications |
Vishay |
3765 |
X7R, VTOP (LOW PROFILE) |
Multilayer Ceramic Chip Capacitors, Very Thin Outline Package, Ideal for Low Headroom Applications |
Vishay |
3766 |
X8R |
Multilayer Ceramic Chip Capacitors, Ideal for Extreme Environments |
Vishay |
3767 |
Z300 |
Axial Cemented Wirewound Resistors, All welded construction. Non flammable cement coating, Ceramic core, Various kinds of lead forming available |
Vishay |
3768 |
Z8400AD1 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3769 |
Z8400AD2 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3770 |
Z8400AD6 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3771 |
Z8400AK1 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3772 |
Z8400AK2 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3773 |
Z8400AK6 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3774 |
Z8400BD1 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3775 |
Z8400BD2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3776 |
Z8400BD6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
3777 |
Z8400BK1 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3778 |
Z8400BK2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3779 |
Z8400BK6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
3780 |
Z8400D1 |
Z80 CPU central processor unit, 2.5MHz, ceramic package |
SGS Thomson Microelectronics |
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