| No. |
Part Name |
Description |
Manufacturer |
| 3751 |
U84C |
84 Pin Ceramic Pin Grid Array |
National Semiconductor |
| 3752 |
U99A |
99 Pin Ceramic Pin Grid Array |
National Semiconductor |
| 3753 |
VITRAMON - CASSETTE PACKAGED CAPS |
Monolithic Ceramic Chip Capacitors, Increased Pick and Place Productivity, Reduced Storage Area Required, Reduced Packaging Waste, Anti-Static and Reusable Cassette Cases |
Vishay |
| 3754 |
VJ0612 (LOW INDUCTANCE) |
Multilayer Ceramic Chip Capacitors, Low Inductance, Reduces AC Noise in Multi-Chip Modules (MCM), Low Profile, Robust Device for Easy Mounting |
Vishay |
| 3755 |
VJ0612 VTOP |
Multilayer Ceramic Chip Capacitors, Low inductance, Reduces AC noise in multi-chip modules (MCM) |
Vishay |
| 3756 |
VJ0805Y223XXX |
Multilayer Ceramic Chip Capacitors |
Vishay |
| 3757 |
VKO |
Ceramic AC Capacitors, Class X1, 440VAC / Class Y2, 300VAC |
Vishay |
| 3758 |
VKP |
Ceramic AC Capacitors, Class X1, 760VAC / Class Y1, 500VAC |
Vishay |
| 3759 |
W |
Surface Mount Chip NTC Thermistors, Top and Bottom Surface Terminations, High-Density Monolithic Ceramic Construction Packaging |
Vishay |
| 3760 |
W1X |
Ceramic Disc Capacitors, Class X1, 275VAC |
Vishay |
| 3761 |
WKP |
Ceramic AC Capacitors, Class X1, 760VAC / Class Y1, 500VAC |
Vishay |
| 3762 |
WYO |
Ceramic AC Capacitors, Class X1, 440VAC / Class Y2, 250VAC |
Vishay |
| 3763 |
X7R / X7S DIELECTRIC |
Multilayer Ceramic Chip Capacitors, Ideal for Decoupling and Filtering, General Purpose Dielectric, Excellent Aging Characteristics, Wide Range of Case Sizes, Voltage Ratings and Capacitance Values |
Vishay |
| 3764 |
X7R DIELECTRIC, HIGH VOLTAGE |
Multilayer Ceramic Chip Capacitors, High Voltage Ratings, Low ESR, Ideal for Surge Suppression and High Voltage Applications |
Vishay |
| 3765 |
X7R, VTOP (LOW PROFILE) |
Multilayer Ceramic Chip Capacitors, Very Thin Outline Package, Ideal for Low Headroom Applications |
Vishay |
| 3766 |
X8R |
Multilayer Ceramic Chip Capacitors, Ideal for Extreme Environments |
Vishay |
| 3767 |
Z300 |
Axial Cemented Wirewound Resistors, All welded construction. Non flammable cement coating, Ceramic core, Various kinds of lead forming available |
Vishay |
| 3768 |
Z8400AD1 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3769 |
Z8400AD2 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3770 |
Z8400AD6 |
Z80 CPU central processor unit, 4.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3771 |
Z8400AK1 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3772 |
Z8400AK2 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3773 |
Z8400AK6 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3774 |
Z8400BD1 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3775 |
Z8400BD2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3776 |
Z8400BD6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3777 |
Z8400BK1 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3778 |
Z8400BK2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3779 |
Z8400BK6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3780 |
Z8400D1 |
Z80 CPU central processor unit, 2.5MHz, ceramic package |
SGS Thomson Microelectronics |
| | | |
