| No. |
Part Name |
Description |
Manufacturer |
| 3841 |
Z8400BK2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3842 |
Z8400BK6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3843 |
Z8400D1 |
Z80 CPU central processor unit, 2.5MHz, ceramic package |
SGS Thomson Microelectronics |
| 3844 |
Z8400D2 |
Z80 CPU central processor unit, 2.5MHz, ceramic package |
SGS Thomson Microelectronics |
| 3845 |
Z8400D6 |
Z80 CPU central processor unit, 2.5MHz, ceramic package |
SGS Thomson Microelectronics |
| 3846 |
Z8400HD1 |
Z80 CPU central processor unit, 8.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3847 |
Z8400HD6 |
Z80 CPU central processor unit, 8.0 MHz, ceramic package |
SGS Thomson Microelectronics |
| 3848 |
Z8400HK1 |
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3849 |
Z8400HK6 |
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3850 |
Z8400K1 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3851 |
Z8400K2 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3852 |
Z8400K6 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 3853 |
ZTX653DCSM |
NPN DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS |
SemeLAB |
| 3854 |
ZTX753DCSM |
PNP DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS |
SemeLAB |
| 3855 |
ZWS |
Cemented Wirewound Resistors with Lugs, Complete welded construction, Ceramic core, Available in adjustable or non-inductive design, Lugs with various termination styles for soldering or bolt connection |
Vishay |
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