| No. |
Part Name |
Description |
Manufacturer |
| 391 |
CGA-6618 |
DUAL CATV BROADBAND HIGH LINEARITY GAAS HBT AMPLIFIER |
Stanford Microdevices |
| 392 |
CIRCULATORS |
General informations, Terms and definitions, standard test specifications |
Philips |
| 393 |
CMF (INDUSTRIAL) |
Industrial, Small Size, Conformal Coating, Flame Retardant Epoxy Coating, Controlled Temperature Coefficient, Excellent High Frequency Characteristics, Low Noise, Low Voltage Coefficient |
Vishay |
| 394 |
CNS (CUSTOM) |
Single-In-Line Conformal Custom |
Vishay |
| 395 |
CNS020, CNS021 THIN FILM |
Single In Line Conformal, Radial Discrete |
Vishay |
| 396 |
CONSUMER-II |
STPC CONSUMER-II DATASHEET / X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP |
ST Microelectronics |
| 397 |
CS206 |
Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP, 4 to 18 pins available, X7R and COG capacitors available, Low cross talk, Custom design capability |
Vishay |
| 398 |
CSC |
Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack |
Vishay |
| 399 |
CURRENT |
Photocoupler - Supplementary Information |
TOSHIBA |
| 400 |
CWR06 |
Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available |
Vishay |
| 401 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 402 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 403 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 404 |
D145 |
Single In-Line Conformal Coated Diode Network |
BI Technologies |
| 405 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 406 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 407 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 408 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 409 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 410 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 411 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 412 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 413 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 414 |
D83 |
Single In-Line Conformal Coated Diode Network |
BI Technologies |
| 415 |
DCR0121SF64 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 416 |
DCR1021SF |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 417 |
DCR1021SF60 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 418 |
DCR1021SF61 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 419 |
DCR1021SF62 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 420 |
DCR1021SF63 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| | | |
