| No. |
Part Name |
Description |
Manufacturer |
| 3961 |
917-99-104-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3962 |
917-99-108-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3963 |
917-99-208-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3964 |
917-99-210-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3965 |
AN264 |
RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS |
SGS Thomson Microelectronics |
| 3966 |
AN577 |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE |
SGS Thomson Microelectronics |
| 3967 |
AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION |
SGS Thomson Microelectronics |
| 3968 |
AS-TQFP44 |
TQFP44 (10x10) socket and cover to solder to an application board for connection of ST emulators. |
ST Microelectronics |
| 3969 |
CR |
Chip, Flow Solderable, Custom Sizes Available, Burn-in Data Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes |
Vishay |
| 3970 |
CRA04S |
4 or 8 Terminal Package, Wraparound Termination, Inner Electrode Protection, Flow Solderable, Automatic Placement Capability |
Vishay |
| 3971 |
CRA06E |
4 or 8 Terminal Package with 2 or 4 Isolated Resistors, Wraparound Termination, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability |
Vishay |
| 3972 |
CRA06P |
Thick Film Resistor Array, 8 terminal package with 4 isolated resistors, Automatic placement capability, Flow solderable, Inner electrode protection, Thick film resistance element |
Vishay |
| 3973 |
CRA06S |
4 or 8 Terminal Package with 2 or 4 Isolated Resistors, Wraparound Termination, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability |
Vishay |
| 3974 |
CRA12E AND S |
4, 8, 10, or 16 Terminal Package, Wraparound Termination, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Choice of Isolated or Bussed Circuits |
Vishay |
| 3975 |
CRCC1206 |
Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size |
Vishay |
| 3976 |
CRCW0201 |
Thick Film Rectangular Chip Resistor, Metal Glaze on High Quality Ceramic, Protective Overglaze, Flow Solderable, Auto Placement Compatibility, Applications Include: Cellular Phones, Memory Modules, PCMCIA Cards |
Vishay |
| 3977 |
CRHV |
Chip, Flow Solderable, Custom Sizes Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes |
Vishay |
| 3978 |
CS & P |
High Value Single Resistor for Wire Bonding and Solder Reflow |
Vishay |
| 3979 |
CWR06 |
Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available |
Vishay |
| 3980 |
CWR11 |
Solid Tantalum Chip Capacitors, TANTAMOUNT® Solid-Electrolyte, Military, MIL-C-55365/8 Qualified, Molded Case Available in Four Case Codes, Automatic Pick and Place Compatible, Solder Plate Terminations |
Vishay |
| 3981 |
CXA49XXXX |
Low Profile Dip Solder / Eyelet Edgecard Connectors |
Sullins Electronics |
| 3982 |
DDP104 |
D Series Dual Port Solder Dip |
Yamaichi Electronics |
| 3983 |
DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3984 |
DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3985 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3986 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3987 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3988 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3989 |
DRB |
90 Solder Dip |
Yamaichi Electronics |
| 3990 |
EBC |
Aluminum Electrolytic Capacitors, Axial Capacitor Style EBC/EGC Solder Ring Termination as EGC03 |
Vishay |
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