| No. |
Part Name |
Description |
Manufacturer |
| 3961 |
917-97-103-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3962 |
917-97-104-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3963 |
917-97-108-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3964 |
917-97-208-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3965 |
917-97-210-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3966 |
917-99-103-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3967 |
917-99-104-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3968 |
917-99-108-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3969 |
917-99-208-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3970 |
917-99-210-41-005 |
TO sockets Solder tail |
Precid-Dip Durtal |
| 3971 |
AB-132 |
SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES |
Burr Brown |
| 3972 |
AN264 |
RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS |
SGS Thomson Microelectronics |
| 3973 |
AN577 |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE |
SGS Thomson Microelectronics |
| 3974 |
AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION |
SGS Thomson Microelectronics |
| 3975 |
AS-TQFP44 |
TQFP44 (10x10) socket and cover to solder to an application board for connection of ST emulators. |
ST Microelectronics |
| 3976 |
BCAAAPC |
ONE AAA CELL HOLDER |
etc |
| 3977 |
BH2CR5-211 |
2CR5 BATTERY HOLDER WITH POLARIZING KEY |
etc |
| 3978 |
BSM100GD120DN2 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3979 |
BSM150GT120DN2 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3980 |
BSM200GT120DN2 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3981 |
BSM75GD120DN2 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3982 |
C67070-A2516-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3983 |
C67070-A2517-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3984 |
C67070-A2518-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3985 |
C67070-A2519-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 3986 |
CR |
Chip, Flow Solderable, Custom Sizes Available, Burn-in Data Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes |
Vishay |
| 3987 |
CRA04S |
4 or 8 Terminal Package, Wraparound Termination, Inner Electrode Protection, Flow Solderable, Automatic Placement Capability |
Vishay |
| 3988 |
CRA06E |
4 or 8 Terminal Package with 2 or 4 Isolated Resistors, Wraparound Termination, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability |
Vishay |
| 3989 |
CRA06P |
Thick Film Resistor Array, 8 terminal package with 4 isolated resistors, Automatic placement capability, Flow solderable, Inner electrode protection, Thick film resistance element |
Vishay |
| 3990 |
CRA06S |
4 or 8 Terminal Package with 2 or 4 Isolated Resistors, Wraparound Termination, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability |
Vishay |
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