No. |
Part Name |
Description |
Manufacturer |
451 |
D..P/CRCW |
Metal Glaze on High Quality Ceramic, Protective Over Glaze, SnPb Contacts on Ni Barrier Layer, Excellent Stability at Different Environmental Conditions |
Vishay |
452 |
D..TR/CRCW....- 29 |
User Trimmable, Metal Glaze on High Quality Ceramic, SnPb Contacts on Ni Barrier Layer |
Vishay |
453 |
DDZX10CTS |
Zener Diodes |
Diodes |
454 |
DDZX11CTS |
Zener Diodes |
Diodes |
455 |
DDZX12CTS |
Zener Diodes |
Diodes |
456 |
DDZX18CTS |
Zener Diodes |
Diodes |
457 |
DDZX20CTS |
Zener Diodes |
Diodes |
458 |
DDZX24CTS |
Zener Diodes |
Diodes |
459 |
DDZX6V8CTS |
Zener Diodes |
Diodes |
460 |
DDZX7V5CTS |
Zener Diodes |
Diodes |
461 |
DDZX8V2CTS |
Zener Diodes |
Diodes |
462 |
DDZX9V1CTS |
Zener Diodes |
Diodes |
463 |
DISCONTINUED PRODUCTS |
August 2, 1999 |
Burr Brown |
464 |
DRV2625 |
Advanced ERM & LRA Haptics Driver with Smart Loop and Embedded Effects Library 9-DSBGA -40 to 85 |
Texas Instruments |
465 |
DRV2625YFFR |
Advanced ERM & LRA Haptics Driver with Smart Loop and Embedded Effects Library 9-DSBGA -40 to 85 |
Texas Instruments |
466 |
DRV2625YFFT |
Advanced ERM & LRA Haptics Driver with Smart Loop and Embedded Effects Library 9-DSBGA -40 to 85 |
Texas Instruments |
467 |
EB346 |
Semiconductor Products Sector Engineering Bulletin |
Motorola |
468 |
EB4 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
469 |
EB4 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
470 |
EB6 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
471 |
EB6 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
472 |
EB7 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
473 |
EB7 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
474 |
EB8 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
475 |
EB8 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
476 |
EBT156 |
Single Readout, Dip Solder, Eyelet and Wire Wrap Termination, Modified Tuning Fork Contacts, Polarization On or Between Contact Positions, Polarizing Key is Reinforced Nylon, Protected Entry |
Vishay |
477 |
EMC1001 |
Thermal Management Products- Temperature Sensors |
Microchip |
478 |
EMC1001-1-AFZQ-TR |
Thermal Management Products- Temperature Sensors |
Microchip |
479 |
EMC1001-AFZQ-TR |
Thermal Management Products- Temperature Sensors |
Microchip |
480 |
EMC1033 |
Thermal Management Products- Temperature Sensors |
Microchip |
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