| No. |
Part Name |
Description |
Manufacturer |
| 451 |
EVAL-AD7898CB |
Evaluation Board for 5V, 12-Bit, Serial 220kSPS ADC in 8-Pin Package |
Analog Devices |
| 452 |
EVAL-AD7899CB |
Evaluation Board for 5V, 12-Bit, Serial 220kSPS ADC in 8-Pin Package |
Analog Devices |
| 453 |
FODM8801 |
OptoHiTTM Series, High-Temperature Phototransistor Optocoupler in Half-Pitch Mini-Flat 4-Pin Package |
Fairchild Semiconductor |
| 454 |
FU-641SEA-1M1 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 455 |
FU-641SEA-1M2 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 456 |
FU-641SEA-1M3 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 457 |
FU-641SEA-1M4 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 458 |
FU-641SEA-1MX |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR, 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 459 |
FU-641SEA-1MX |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR, 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 460 |
G12B |
12-Lead (0.400 In. Square Pattern) TO-8 Metal Can Package |
National Semiconductor |
| 461 |
GN20 |
GN Package XX-Lead Plastic SSOP (Narrow .150 Inch) |
etc |
| 462 |
GN24 |
GN Package XX-Lead Plastic SSOP (Narrow .150 Inch) |
etc |
| 463 |
GN28 |
GN Package XX-Lead Plastic SSOP (Narrow .150 Inch) |
etc |
| 464 |
H02A |
2 Lead (0.100 in. Diameter P.C.) TO-46 Metal Can Package |
National Semiconductor |
| 465 |
H03A |
3 Lead (0.200 in. Diameter P.C.) TO-39 Metal Can Package, Low Profile |
National Semiconductor |
| 466 |
H03B |
3 Lead (0.200 in. Diameter P.C.) TO-39 Metal Can Package, High Profile |
National Semiconductor |
| 467 |
H03C |
3 Lead (0.100 in. Diameter P.C.) TO-18 Metal Can Package |
National Semiconductor |
| 468 |
H03H |
3 Lead (0.100 in. Diameter P.C.) TO-46 Metal Can Package |
National Semiconductor |
| 469 |
H03J |
3 Lead (0.100 in. Diameter P.C.) TO-52 Metal Can Package |
National Semiconductor |
| 470 |
H04A |
4 Lead (0.100 in. Diameter P.C.) TO-46 Metal Can Package |
National Semiconductor |
| 471 |
H04C |
4 Lead (0.100 in. Diameter P.C.) TO-72 Metal Can Package |
National Semiconductor |
| 472 |
H04D |
4 Lead (0.100 in. Diameter P.C.) Shielded TO-46 Metal Can Package |
National Semiconductor |
| 473 |
H06C |
6 Lead (0.200 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 474 |
H08A |
8 Lead (0.230 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 475 |
H08B |
8-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 476 |
H08C |
8 Lead (0.200 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 477 |
H08D |
8-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 478 |
H10C |
10 Lead (0.230 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 479 |
H10F |
10-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
| 480 |
H10G |
10-Lead (0.230 In. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
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