| No. |
Part Name |
Description |
Manufacturer |
| 4591 |
MPB125-3000 |
High Power Density in Industry Standard 3 x 5 Footprint |
Power-One |
| 4592 |
MPB125-4250 |
High Power Density in Industry Standard 3 x 5 Footprint |
Power-One |
| 4593 |
MPB125-4350 |
High Power Density in Industry Standard 3 x 5 Footprint |
Power-One |
| 4594 |
MPXY8000 |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4595 |
MPXY8020A |
Tire Pressure Monitoring Sensor |
Motorola |
| 4596 |
MPXY8020A6T1 |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4597 |
MPXY8020A6T1 |
TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT |
Motorola |
| 4598 |
MPXY8020A6U |
TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT |
Motorola |
| 4599 |
MPXY8020A6U |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4600 |
MPXY8021A |
Tire Pressure Monitoring Sensor |
Motorola |
| 4601 |
MPXY8021A6T1 |
Tire Pressure Monitoring Sensor |
Motorola |
| 4602 |
MPXY8021A6U |
Tire Pressure Monitoring Sensor |
Motorola |
| 4603 |
MPXY8040A |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4604 |
MPXY8040A6T1 |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4605 |
MPXY8040A6U |
Tire Pressure Monitoring Sensor Temperature Compensated |
Motorola |
| 4606 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 4607 |
MQA24 |
24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 4608 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
| 4609 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 4610 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 4611 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 4612 |
MSA24 |
24 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 4613 |
MSA28 |
28-Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 4614 |
MSC4000 |
Common base silicon NPN microwave power transistor featuring a unique Microgrid™ structure |
SGS Thomson Microelectronics |
| 4615 |
MSC80064 |
Hermetically sealed NPN power transistor featuring a unique matrix structure |
SGS Thomson Microelectronics |
| 4616 |
MSP430F67621 |
MSP430F676x1 - Low cost 3-phase metering SOC 100-LQFP -40 to 85 |
Texas Instruments |
| 4617 |
MSP430F67621A |
MSP430F676x1A Polyphase Metering SoCs 100-LQFP -40 to 85 |
Texas Instruments |
| 4618 |
MSP430F67621AIPN |
MSP430F676x1A Polyphase Metering SoCs 80-LQFP -40 to 85 |
Texas Instruments |
| 4619 |
MSP430F67621AIPNR |
MSP430F676x1A Polyphase Metering SoCs 80-LQFP -40 to 85 |
Texas Instruments |
| 4620 |
MSP430F67621AIPZ |
MSP430F676x1A Polyphase Metering SoCs 100-LQFP -40 to 85 |
Texas Instruments |
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