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Datasheets for MOL

Datasheets found :: 1216
Page: | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 |
No. Part Name Description Manufacturer
481 MDP16-45 Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Vishay
482 MDP16-46 Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Vishay
483 MDP16-46 Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Vishay
484 MDRC Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs Vishay
485 MDRC Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs Vishay
486 MGF0952P L & S BAND GaAs FET [ Plastic Mold Lead-less PKG ] Mitsubishi Electric Corporation
487 MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT Mitsubishi Electric Corporation
488 MKT-TA05A TO-220, MOLDED, SURFACE MOUNT, 5 LEAD National Semiconductor
489 MKT-TA07B TO - 220 MOLDED 7 LEAD STAGGERED National Semiconductor
490 MKT-TS15B TO-263, MOLDED, 15 LEAD, SURFACE MOUNT National Semiconductor
491 MPM SOT-23 Molded 2 resistor Center-Tap Precision Divider Vishay
492 MQA20 20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
493 MQA24 24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
494 MRCN Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 Vishay
495 MS40A 40 Lead Molded Shrink Small Outline Package, EIAJ, Type III National Semiconductor
496 MS48A 48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
497 MS56A 56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
498 MSA20 20 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
499 MSA24 24 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
500 MSA28 28-Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
501 MSM Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Single-In-Line, Molded SIP; 01, 03, 05 Schematics Vishay
502 MSP Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible Vishay
503 MSP Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible Vishay
504 MSP01 Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
505 MSP03 Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
506 MSP05 Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
507 MSP06 Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
508 MSP06A Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
509 MSP06C Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay
510 MSP08 Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile Vishay


Datasheets found :: 1216
Page: | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 |



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