| No. |
Part Name |
Description |
Manufacturer |
| 481 |
DS34T101GN |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 482 |
DS34T101GN+ |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 483 |
DS34T102 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 484 |
DS34T102GN+ |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 485 |
DS34T104 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 486 |
DS34T104GN |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 487 |
DS34T104GN+ |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 488 |
DS34T108 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 489 |
DS34T108DK-L1 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 490 |
DS34T108DK-L4 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 491 |
DS34T108DK-L5 |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 492 |
DS34T108GN |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 493 |
DS34T108GN+ |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
MAXIM - Dallas Semiconductor |
| 494 |
ISL3282E |
�16.5kV ESD Protected, +125�C, 3.0V to 5.5V, TDFN Package, 20Mbps, Full Fail-safe, Low Power, RS-485/RS-422 Receivers |
Intersil |
| 495 |
ISL3282EMRTEP |
�16.5kV ESD Protected, +125�C, 3.0V to 5.5V, TDFN Packaged, 16Mbps, Full Fail-safe, Low Power, RS-485/RS-422 Receiver |
Intersil |
| 496 |
ISL3298EMRTEP |
16kV ESD Protected, +125�C, 3.0V to 5.5V, TDFN Packaged, Low Power RS-485/RS-422 Transmitter |
Intersil |
| 497 |
ISL5761_2IA |
210MHz; 10-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 498 |
ISL5761_2IB |
210MHz; 10-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 499 |
ISL5861_2IA |
210MHz; 3.6V; 12-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 500 |
ISL5861_2IB |
210MHz; 3.6V; 12-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 501 |
ISL5961_2IA |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 502 |
ISL5961_2IB |
3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. |
Intersil |
| 503 |
MAAPSS0003 |
1750-1910 MHz PCS TDMA/CDMA power amplifier |
MA-Com |
| 504 |
MAAPSS0003 |
PCS TDMA/CDMA Power Amplifier 1750 - 1910 MHz |
Tyco Electronics |
| 505 |
MAAPSS0003RTR |
1750-1910 MHz PCS TDMA/CDMA power amplifier |
MA-Com |
| 506 |
MAAPSS0003RTR |
PCS TDMA/CDMA Power Amplifier 1750 - 1910 MHz |
Tyco Electronics |
| 507 |
MAAPSS0003TR |
1750-1910 MHz PCS TDMA/CDMA power amplifier |
MA-Com |
| 508 |
MAAPSS0003TR |
PCS TDMA/CDMA Power Amplifier 1750 - 1910 MHz |
Tyco Electronics |
| 509 |
MAX1086EKA |
150ksps, 10-Bit, 2-Channel Single-Ended, and 1-Channel True-Differential ADCs in SOT23 and TDFN |
MAXIM - Dallas Semiconductor |
| 510 |
MAX1086ETA+ |
150ksps, 10-Bit, 2-Channel Single-Ended, and 1-Channel True-Differential ADCs in SOT23 and TDFN |
MAXIM - Dallas Semiconductor |
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