| No. |
Part Name |
Description |
Manufacturer |
| 481 |
1N976B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 482 |
1N977B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 483 |
1N977B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 484 |
1N978B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 485 |
1N978B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 486 |
1N979B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 487 |
1N979B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 488 |
1N980B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 489 |
1N980B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 490 |
1N981B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 491 |
1N981B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 492 |
1N982B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 493 |
1N982B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 494 |
1N983B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 495 |
1N983B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 496 |
1N984B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 497 |
1N984B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 498 |
1N985B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 499 |
1N985B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 500 |
1N986B |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 501 |
1N986B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 502 |
1N986B-1 |
METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
Microsemi |
| 503 |
2017 |
28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
| 504 |
2023-1 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
| 505 |
2023-3 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
| 506 |
2023-6 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
| 507 |
2032 |
28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
| 508 |
2327-1 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
| 509 |
2327-3 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
| 510 |
2327-5 |
Is an internally-matched device (transistor) decifically designed for 2GHz telecommunications and telemetry applications |
SGS Thomson Microelectronics |
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