| No. |
Part Name |
Description |
Manufacturer |
| 4861 |
RESISTORS - WIREWOUND FUSE RESISTORS |
Fusible, Fast Acting Molded Styles, Custom Designed for Your Application, High Temperature Silicone Molded Package |
Vishay |
| 4862 |
RF-HDT-DVBB |
13.56-MHz Overmolded Transponder Based on Tag-it HF-I Plus Die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4863 |
RF-HDT-DVBB-N1 |
13.56-MHz Overmolded Transponder Based on Tag-it HF-I Plus Die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4864 |
RF-HDT-DVBB-N2 |
13.56-MHz Overmolded Transponder Based on Tag-it HF-I Plus Die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4865 |
RF-HDT-DVBE |
13.56-MHz Overmolded Transponder based on Tag-it HF-I Standard die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4866 |
RF-HDT-DVBE-N0 |
13.56-MHz Overmolded Transponder based on Tag-it HF-I Standard die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4867 |
RF-HDT-DVBE-N2 |
13.56-MHz Overmolded Transponder based on Tag-it HF-I Standard die 0-RFIDP -25 to 90 |
Texas Instruments |
| 4868 |
RH-1 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4869 |
RH-10 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4870 |
RH-15 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4871 |
RH-16 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4872 |
RH-2 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4873 |
RH-8 |
Holder and applicable transistor (Package) |
TOSHIBA |
| 4874 |
SIPS, DIPS, COATED SIPS |
Custom Networks, Fast Turnaround Time, Unlimited Schematics Possible, Processed to MIL-PRF-83401 Spec, High Temperature Solder Joints, Custom Resistor, Capacitor, Diode, and Inductor Network Combinations |
Vishay |
| 4875 |
SML512 |
LOW CURRENT TY PE MINI MOLDED CHIP LEDS |
ROHM |
| 4876 |
SML512BC4T |
LOW CURRENT TY PE MINI MOLDED CHIP LEDS |
ROHM |
| 4877 |
SMM0102 |
Stable Metal Film on High Quality Ceramic, Force Fitted Steel Caps, Tin Plated on Nickel Barrier, Excellent Stability, Reliable Solderable Terminations to Facilitate Surface Mounting |
Vishay |
| 4878 |
SMM0204 |
Stable Metal Film on High Quality Ceramic, Force Fitted Steel Caps, Tin Plated on Nickel Barrier, Excellent Stability at Different Environmental Conditions, Reliable Solderable Terminations to Facilitate Surface Mounting |
Vishay |
| 4879 |
SMM0207 |
Stable Metal Film on High Quality Ceramic, Force Fitted Steel Caps, Tin Plated on Nickel Barrier, High Power Rating, Good Thermal Distribution, Reliable Solderable Terminations to Facilitate Surface Mounting |
Vishay |
| 4880 |
SMN |
Bulk Metal® Foil Technology, 4 Resistor Precision Surface Mount Network, Dual-In-Line Molded Package 50 MIL Pitch |
Vishay |
| 4881 |
SMR1D |
Molded Resistor |
Vishay |
| 4882 |
SMR3D |
Molded Resistor |
Vishay |
| 4883 |
SMRC1D |
Molded Resistor |
Vishay |
| 4884 |
SMRC3D |
Molded Resistor |
Vishay |
| 4885 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 4886 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 4887 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 4888 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 4889 |
SOLDERING |
Soldering information - maximul conditions, flow soldering method |
PLESSEY Semiconductors |
| 4890 |
SOLDERING |
Soldering information - maximul conditions, flow soldering method |
PLESSEY Semiconductors |
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