| No. |
Part Name |
Description |
Manufacturer |
| 5341 |
5962-9755701HYC |
5962-9755701HYC · Hermetically Sealed Analog Isolation Amplifier |
Agilent (Hewlett-Packard) |
| 5342 |
5962-9855201QXA |
RadHard microcontroller: SMD. 12 MHz operating frequency. Class Q. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5343 |
5962-9855201QZA |
RadHard microcontroller: SMD. 12 MHz operating frequency. Class Q. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5344 |
5962-9855201VXA |
RadHard microcontroller: SMD. 12 MHz operating frequency. Class V. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5345 |
5962-9855201VZA |
RadHard microcontroller: SMD. 12 MHz operating frequency. Class V. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5346 |
5962-9855202QXA |
RadHard microcontroller: SMD. 16 MHz operating frequency. Class Q. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5347 |
5962-9855202QZA |
RadHard microcontroller: SMD. 16 MHz operating frequency. Class Q. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5348 |
5962-9855202VXA |
RadHard microcontroller: SMD. 16 MHz operating frequency. Class V. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5349 |
5962-9855202VZA |
RadHard microcontroller: SMD. 16 MHz operating frequency. Class V. Lead finish solder. Total dose none. |
Aeroflex Circuit Technology |
| 5350 |
5962-9858301QXA |
16-bit microcontroller: SMD. Total dose none. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
| 5351 |
5962-9858302QXA |
16-bit microcontroller: SMD. Total dose none. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
| 5352 |
5962-9858701QXA |
SuMMIT RTE MIL-STD-1553 dual redundant remote terminal w/integrated bus transceiver & memory: SMD. +5V operation. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
| 5353 |
5962-9960601QUA |
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose none. |
Aeroflex Circuit Technology |
| 5354 |
5962-9960601TUA |
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none. |
Aeroflex Circuit Technology |
| 5355 |
5962-9960602QUA |
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. Total dose none. |
Aeroflex Circuit Technology |
| 5356 |
5962-9960602TUA |
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. Total dose none. |
Aeroflex Circuit Technology |
| 5357 |
5962-JM38510_55501BZA |
RTI remote terminal interface. 10% to 35% clock duty cycle. Jan class Q. Lead finish solder. |
Aeroflex Circuit Technology |
| 5358 |
5962D0053601QUA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5359 |
5962D0053601QXA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5360 |
5962D0053601TUA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5361 |
5962D0053601TXA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5362 |
5962D0053602QUA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5363 |
5962D0053602QXA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5364 |
5962D0053602TUA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5365 |
5962D0053602TXA |
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5366 |
5962D0053603QUA |
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5367 |
5962D0053603QXA |
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5368 |
5962D0053603TUA |
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5369 |
5962D0053603TXA |
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
| 5370 |
5962D0053604QUA |
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). |
Aeroflex Circuit Technology |
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