| No. |
Part Name |
Description |
Manufacturer |
| 5611 |
UT8Q512-20UCA |
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 5612 |
UT8Q512-20UWA |
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Extended industrial temperature range flow. |
Aeroflex Circuit Technology |
| 5613 |
UT8Q512-ICA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 5614 |
UT8Q512-UCA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 5615 |
UT8Q512-UWA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Extended industrial temperature range flow. |
Aeroflex Circuit Technology |
| 5616 |
UT8R128K32-15WCA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5617 |
UT8R128K32-15WWA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5618 |
UT8R256K1615TBDCA |
256K x 16 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5619 |
UT8R512K8-15UCA |
512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5620 |
UT8R512K8-15UWA |
512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5621 |
UT9Q512-20ICA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5622 |
UT9Q512-20IWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5623 |
UT9Q512-20UCA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5624 |
UT9Q512-20UWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5625 |
UT9Q512-ICA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5626 |
UT9Q512-IWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5627 |
UT9Q512-UCA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5628 |
UT9Q512-UWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 5629 |
V20A |
20 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5630 |
V28A |
28 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5631 |
V32A |
32 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5632 |
V44A |
44 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5633 |
V52A |
52 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5634 |
V68A |
68 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5635 |
V84A |
84 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5636 |
VA32A |
32 Lead Molded Plastic Leaded Chip Carrier |
National Semiconductor |
| 5637 |
VBG48A |
48 Lead (7mm x 7mm) Molded Plastic Quad Flat Package, JEDEC |
National Semiconductor |
| 5638 |
VBH48A |
48-Lead Molded Thin Quad Flat Package, JEDEC |
National Semiconductor |
| 5639 |
VCC80A |
80 Lead (14mm x 20mm) Molded Plastic Quad Flat Package, JEDEC |
National Semiconductor |
| 5640 |
VEF44A |
44 Lead (10mm x 10mm) Molded Plastic Quad Flat Package, EIAJ |
National Semiconductor |
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