| No. |
Part Name |
Description |
Manufacturer |
| 571 |
TIP-N-RING |
Multilayer Ceramic Chip Capacitors, Ideal for Telephone Line (Tip `N Ring) Filtering, Replaces High Voltage, Leaded, Film Capacitors, Rated for Telecommunications Voltages, Low ESR, Wide Ban |
Vishay |
| 572 |
VITRAMON - CASSETTE PACKAGED CAPS |
Monolithic Ceramic Chip Capacitors, Increased Pick and Place Productivity, Reduced Storage Area Required, Reduced Packaging Waste, Anti-Static and Reusable Cassette Cases |
Vishay |
| 573 |
VJ0612 (LOW INDUCTANCE) |
Multilayer Ceramic Chip Capacitors, Low Inductance, Reduces AC Noise in Multi-Chip Modules (MCM), Low Profile, Robust Device for Easy Mounting |
Vishay |
| 574 |
VJ0612 VTOP |
Multilayer Ceramic Chip Capacitors, Low inductance, Reduces AC noise in multi-chip modules (MCM) |
Vishay |
| 575 |
VJ0805Y223XXX |
Multilayer Ceramic Chip Capacitors |
Vishay |
| 576 |
W |
Surface Mount Chip NTC Thermistors, Top and Bottom Surface Terminations, High-Density Monolithic Ceramic Construction Packaging |
Vishay |
| 577 |
X7R / X7S DIELECTRIC |
Multilayer Ceramic Chip Capacitors, Ideal for Decoupling and Filtering, General Purpose Dielectric, Excellent Aging Characteristics, Wide Range of Case Sizes, Voltage Ratings and Capacitance Values |
Vishay |
| 578 |
X7R DIELECTRIC, HIGH VOLTAGE |
Multilayer Ceramic Chip Capacitors, High Voltage Ratings, Low ESR, Ideal for Surge Suppression and High Voltage Applications |
Vishay |
| 579 |
X7R, VTOP (LOW PROFILE) |
Multilayer Ceramic Chip Capacitors, Very Thin Outline Package, Ideal for Low Headroom Applications |
Vishay |
| 580 |
X8R |
Multilayer Ceramic Chip Capacitors, Ideal for Extreme Environments |
Vishay |
| 581 |
Z300 |
Axial Cemented Wirewound Resistors, All welded construction. Non flammable cement coating, Ceramic core, Various kinds of lead forming available |
Vishay |
| 582 |
Z8400AK1 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 583 |
Z8400AK2 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 584 |
Z8400AK6 |
Z80 CPU central processor unit, 4.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 585 |
Z8400BK1 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 586 |
Z8400BK2 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 587 |
Z8400BK6 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 588 |
Z8400HK1 |
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 589 |
Z8400HK6 |
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 590 |
Z8400K1 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 591 |
Z8400K2 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 592 |
Z8400K6 |
Z80 CPU central processor unit, 2.5MHz, ceramic chip-carrier package |
SGS Thomson Microelectronics |
| 593 |
ZWS |
Cemented Wirewound Resistors with Lugs, Complete welded construction, Ceramic core, Available in adjustable or non-inductive design, Lugs with various termination styles for soldering or bolt connection |
Vishay |
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