| No. |
Part Name |
Description |
Manufacturer |
| 6061 |
DZ23C5V6 |
ZENER DIODES |
Micro Commercial Components |
| 6062 |
DZ23C62 |
ZENER DIODES |
Micro Commercial Components |
| 6063 |
DZ23C68 |
ZENER DIODES |
Micro Commercial Components |
| 6064 |
DZ23C6V2 |
ZENER DIODES |
Micro Commercial Components |
| 6065 |
DZ23C6V8 |
ZENER DIODES |
Micro Commercial Components |
| 6066 |
DZ23C75 |
ZENER DIODES |
Micro Commercial Components |
| 6067 |
DZ23C7V5 |
ZENER DIODES |
Micro Commercial Components |
| 6068 |
DZ23C8V2 |
ZENER DIODES |
Micro Commercial Components |
| 6069 |
DZ23C9V1 |
ZENER DIODES |
Micro Commercial Components |
| 6070 |
EB4 |
Dual Readout, Standard and Right Angle Terminals, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 6071 |
EB4 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 6072 |
EB6 |
Dual Readout, Standard and Right Angle Terminals, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 6073 |
EB6 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 6074 |
EB7 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 6075 |
EB8 |
Dual Readout, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 6076 |
EB8 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 6077 |
ECQV |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6078 |
ECQV1103JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6079 |
ECQV1104JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6080 |
ECQV1123JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6081 |
ECQV1124JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6082 |
ECQV1153JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6083 |
ECQV1154JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6084 |
ECQV1183JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6085 |
ECQV1184JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6086 |
ECQV1223JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6087 |
ECQV1224JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6088 |
ECQV1273JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6089 |
ECQV1274JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 6090 |
ECQV1333JM |
Designed for application where high density insertion of components is required. |
Panasonic |
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