| No. |
Part Name |
Description |
Manufacturer |
| 61 |
AWT1921S11 |
Integrated High Power Amp 1610 MHz Advanced Product information |
Anadigics Inc |
| 62 |
AWT921S11 |
Integrated High Power Amp 900 MHz Advanced Product information |
Anadigics Inc |
| 63 |
BSM200GB170DLC |
Technical Information |
Eupec GmbH |
| 64 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 65 |
C20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 66 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 67 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 68 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 69 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 70 |
C504D |
12L digital processor for 14 bit wide output information and additional functions |
RFT |
| 71 |
CIRCULATORS |
General informations, Terms and definitions, standard test specifications |
Philips |
| 72 |
CONSUMER-II |
STPC CONSUMER-II DATASHEET / X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP |
ST Microelectronics |
| 73 |
CURRENT |
Photocoupler - Supplementary Information |
TOSHIBA |
| 74 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 75 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 76 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 77 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 78 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 79 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 80 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 81 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 82 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 83 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 84 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 85 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 86 |
DCR0121SF64 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 87 |
DCR1021SF |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 88 |
DCR1021SF60 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 89 |
DCR1021SF61 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| 90 |
DCR1021SF62 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
| | | |
