No. |
Part Name |
Description |
Manufacturer |
61 |
CASE 79-05 |
Package Outline Dimensions |
Motorola |
62 |
CASE D |
PACKAGE OUTLINE DRAWINGS |
Sprague |
63 |
CM8 |
8 LEAD TO8 Package Outlines |
PLESSEY Semiconductors |
64 |
DC14 |
15 LEAD DILMON Package Outlines |
PLESSEY Semiconductors |
65 |
DG14 |
14 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
66 |
DG16 |
16 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
67 |
DG8 |
8 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
68 |
DO-35 |
DO35 Package Outlines |
Newmarket Transistors NKT |
69 |
DO-7 |
DO7 Package Outlines |
Newmarket Transistors NKT |
70 |
DP14 |
14 LEAD PLASTIC DIL Package Outlines |
PLESSEY Semiconductors |
71 |
DP8 |
8 LEAD PLASTIC DIL Package Outlines |
PLESSEY Semiconductors |
72 |
HCS101 |
The HCS101 is a fixed code encoder designed for remote control systems. Its small package outline and low cost make this device a perfect solution for unidirectional remote control systems. The HCS101 is pin compatible with Microchip’ |
Microchip |
73 |
HCS200 |
The HCS200 is a code hopping encoder designed for Remote Keyless Entry (RKE) systems. The HCS200 utilizes Microchip’s patented KEELOQ® code hopping technology, which incorporates high security, a small package outline and low co |
Microchip |
74 |
HCS201 |
The HCS201 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS201 utilizes Microchip’s patented KEELOQ® code hopping technology, which incorporates high security, a small package outline and |
Microchip |
75 |
HCS300 |
The HCS300 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS300 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline and low |
Microchip |
76 |
HCS301 |
The HCS301 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS301 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
77 |
HCS320 |
The HCS320 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS320 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
78 |
HCS360 |
The HCS360 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS360 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
79 |
HCS361 |
The HCS361 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS361 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
80 |
HCS362 |
The HCS362 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS362 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
81 |
HCS365 |
The HCS365 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS365 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
82 |
HCS370 |
The HCS370 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS370 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
83 |
IC PACKAGES |
Plastic Package Outlines, P-DIP, 4, 6 8, 14 pins, 20A DIN 41866 |
Siemens |
84 |
ICS280 |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
85 |
ICS280PG |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
86 |
ICS280PGI |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
87 |
ICS280PGILF |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
88 |
ICS280PGLF |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
89 |
PACKAGE OUTLINES |
Package Outlines, Shape and dimensions |
Intersil |
90 |
PACKAGE OUTLINES |
Package Outlines, Shape and dimensions |
Intersil |
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